Warpage phenomenon of thin-wall injection molding

Yuh Chyun Chiang, Hsin Chung Cheng, Chiung Fang Huang, Jeou Long Lee, Yi Lin, Yung Kang Shen

研究成果: 雜誌貢獻文章

20 引文 (Scopus)

摘要

This study investigates warpage of electronic dictionary battery covers fabricated using thin-wall injection molding as a replacement for conventional insert molding. The primary concern is the molding window in thin-wall injection molding for acrylonitrile-butadiene styrene (ABS) and polycarbonate (PC)+ABS plastics. Finally, the process parameters for thin-wall injection molding that eliminate warpage of electronic dictionary battery covers are identified. Experimental results demonstrate that the area of the molding window for ABS exceeds that for PC+ABS. Analysis of the molding window reveals that ABS is more appropriate than PC+ABS for battery covers. Low melt temperature, high injection speed, and high packing pressure eliminate battery cover warpage. Melt temperature is the most important process parameter for eliminating warpage when using both ABS and PC+ABS.
原文英語
頁(從 - 到)517-526
頁數10
期刊International Journal of Advanced Manufacturing Technology
55
發行號5-8
DOIs
出版狀態已發佈 - 七月 2011

指紋

Butadiene
Injection molding
Styrene
Polycarbonates
Molding
Glossaries
Die casting inserts
Plastics
Temperature

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Control and Systems Engineering
  • Computer Science Applications
  • Software
  • Mechanical Engineering

引用此文

Warpage phenomenon of thin-wall injection molding. / Chiang, Yuh Chyun; Cheng, Hsin Chung; Huang, Chiung Fang; Lee, Jeou Long; Lin, Yi; Shen, Yung Kang.

於: International Journal of Advanced Manufacturing Technology, 卷 55, 編號 5-8, 07.2011, p. 517-526.

研究成果: 雜誌貢獻文章

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