Treating chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation process with surfactant

C. Y. Hu, S. L. Lo, C. M. Li, W. H. Kuan

研究成果: 雜誌貢獻文章同行評審

44 引文 斯高帕斯(Scopus)

摘要

The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in this study to compare the effect of cationic (CTAB) and anodic (SDS) surfactants on ECF. The cationic surfactant can enhance the removal of the turbidity, but anodic surfactant cannot. It can be explained by the hetero-coagulation theory. Moreover, the addition of CTAB in CMP wastewater can reduce the sludge volume and the flotation/sedimentation time in ECF process. The residual turbidity and dissolved silicon dropped with the increase of charge loading. No CTAB pollution problem exists after the ECF process.

原文英語
頁(從 - 到)15-20
頁數6
期刊Journal of Hazardous Materials
120
發行號1-3
DOIs
出版狀態已發佈 - 四月 11 2005
對外發佈

ASJC Scopus subject areas

  • 化學健康與安全
  • 製程化學與技術
  • 安全、風險、可靠性和品質
  • 環境工程

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