Three-dimensional simulation of flip chip encapsulation process

Y. K. Shen, H. C. Lee

研究成果: 雜誌貢獻文章同行評審

2 引文 斯高帕斯(Scopus)

摘要

Flip chip package is the most important technology in IC package for the necessary of scale, velocity and cost by the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. This paper indicates that the analysis for package of the solder ball and chip. A finite element simulation of moving boundaries in a three-dimensional inertia-free, incompressible flow is presented. A control volume scheme with a fixed finite element mesh is employed to predict fluid front advancement. The epoxy is used for the package material. The injection situation uses for one line injection, L line injection, U line injection and central point injection location. The injection process uses for different parameters (mold temperature, injection temperature, injection pressure, injection time). The results show that the mold temperature is the most factor for processing parameters. It indicates that the L line injection is the best injection situation on flip chip package.
原文英語
頁(從 - 到)961-970
頁數10
期刊International Communications in Heat and Mass Transfer
29
發行號7
DOIs
出版狀態已發佈 - 十月 2002
對外發佈Yes

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Mechanical Engineering

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