The effect on the microstructures of electroless nickel coatings initiated by pulsating electric current

Chung Kwei Lin, Hsien Ta Hsu, Chin Te Chen, Tsong Jen Yang

研究成果: 雜誌貢獻文章同行評審

2 引文 斯高帕斯(Scopus)

摘要

In this study, pulsating electric current was applied during the electroless Ni plating process. The applied current is controlled to avoid the formation of an immersion (displacement) deposit. The effects of the current density (0.5 and 1.0 A/dm2), duty cycle (0 to 100%, in a step of 10%), and bath pH value (4.4 and 4.8) were investigated systematically. The as-plated coatings were examined by atomic force microscopy, transmission electron microscopy, X-ray diffraction, synchrotron X-ray absorption spectroscopy, etc. Amorphous or amorphous-like microstructure was obtained for all as-plated coatings and the phosphorus content was higher than 8.9 wt.%. Experimental results showed that pulsating electric current can initiate Ni nanocrystallization (∼ 5 nm), improve crystal growth, and accelerate electroless Ni deposition. An obvious increase in deposition rate was also observed with pulsating electric current.
原文英語
頁(從 - 到)355-359
頁數5
期刊Thin Solid Films
516
發行號2-4
DOIs
出版狀態已發佈 - 十二月 3 2007
對外發佈

ASJC Scopus subject areas

  • 電子、光磁材料
  • 表面和介面
  • 表面、塗料和薄膜
  • 金屬和合金
  • 材料化學

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