Self-Assembly and Autopolymerization of Pyrrole and Characteristics of Electrodeposition of Polypyrrole on Roughened Au(111) Modified by Underpotentially Deposited Copper

Yu Chuan Liu, Thomas C. Chuang

研究成果: 雜誌貢獻文章

48 引文 (Scopus)

摘要

By combining techniques of underpotential deposition (UPD) and roughening metal substrates by a triangularwave oxidation-reduction cycle (ORC) which is generally used in surface-enhanced Raman scattering (SERS) studies, and extending applications of self-assembled monolayers (SAMs), copper is underpotentially deposited on electrochemically roughened Au(111) in this study for the first time. The formation of SAMs and further autopolymerization of pyrrole monomers are found on the UPD Cu-modified gold surfaces. The stability of SAMs is significantly improved due to the presence of UPD Cu. Furthermore, electropolymerized polypyrrole (PPy) on this UPD Cu-modified roughened Au demonstrates some distinguishing properties. These include higher conductivities, higher intensity, and better resolution on SERS and improved anti-aging ability in a 50% relative humility, 20% (v/v) O2 atmosphere at 30 °C for 60 days.

原文英語
頁(從 - 到)9802-9807
頁數6
期刊Journal of Physical Chemistry B
107
發行號36
出版狀態已發佈 - 九月 11 2003
對外發佈Yes

指紋

Pyrroles
polypyrroles
Polypyrroles
pyrroles
Electrodeposition
electrodeposition
Self assembly
self assembly
Copper
Self assembled monolayers
copper
Raman scattering
Raman spectra
Gold
monomers
Aging of materials
Monomers
Metals
gold
atmospheres

ASJC Scopus subject areas

  • Physical and Theoretical Chemistry

引用此文

@article{ef719a57d85e4f7f97d07b7676a40036,
title = "Self-Assembly and Autopolymerization of Pyrrole and Characteristics of Electrodeposition of Polypyrrole on Roughened Au(111) Modified by Underpotentially Deposited Copper",
abstract = "By combining techniques of underpotential deposition (UPD) and roughening metal substrates by a triangularwave oxidation-reduction cycle (ORC) which is generally used in surface-enhanced Raman scattering (SERS) studies, and extending applications of self-assembled monolayers (SAMs), copper is underpotentially deposited on electrochemically roughened Au(111) in this study for the first time. The formation of SAMs and further autopolymerization of pyrrole monomers are found on the UPD Cu-modified gold surfaces. The stability of SAMs is significantly improved due to the presence of UPD Cu. Furthermore, electropolymerized polypyrrole (PPy) on this UPD Cu-modified roughened Au demonstrates some distinguishing properties. These include higher conductivities, higher intensity, and better resolution on SERS and improved anti-aging ability in a 50{\%} relative humility, 20{\%} (v/v) O2 atmosphere at 30 °C for 60 days.",
author = "Liu, {Yu Chuan} and Chuang, {Thomas C.}",
year = "2003",
month = "9",
day = "11",
language = "English",
volume = "107",
pages = "9802--9807",
journal = "Journal of Physical Chemistry B Materials",
issn = "1520-6106",
publisher = "American Chemical Society",
number = "36",

}

TY - JOUR

T1 - Self-Assembly and Autopolymerization of Pyrrole and Characteristics of Electrodeposition of Polypyrrole on Roughened Au(111) Modified by Underpotentially Deposited Copper

AU - Liu, Yu Chuan

AU - Chuang, Thomas C.

PY - 2003/9/11

Y1 - 2003/9/11

N2 - By combining techniques of underpotential deposition (UPD) and roughening metal substrates by a triangularwave oxidation-reduction cycle (ORC) which is generally used in surface-enhanced Raman scattering (SERS) studies, and extending applications of self-assembled monolayers (SAMs), copper is underpotentially deposited on electrochemically roughened Au(111) in this study for the first time. The formation of SAMs and further autopolymerization of pyrrole monomers are found on the UPD Cu-modified gold surfaces. The stability of SAMs is significantly improved due to the presence of UPD Cu. Furthermore, electropolymerized polypyrrole (PPy) on this UPD Cu-modified roughened Au demonstrates some distinguishing properties. These include higher conductivities, higher intensity, and better resolution on SERS and improved anti-aging ability in a 50% relative humility, 20% (v/v) O2 atmosphere at 30 °C for 60 days.

AB - By combining techniques of underpotential deposition (UPD) and roughening metal substrates by a triangularwave oxidation-reduction cycle (ORC) which is generally used in surface-enhanced Raman scattering (SERS) studies, and extending applications of self-assembled monolayers (SAMs), copper is underpotentially deposited on electrochemically roughened Au(111) in this study for the first time. The formation of SAMs and further autopolymerization of pyrrole monomers are found on the UPD Cu-modified gold surfaces. The stability of SAMs is significantly improved due to the presence of UPD Cu. Furthermore, electropolymerized polypyrrole (PPy) on this UPD Cu-modified roughened Au demonstrates some distinguishing properties. These include higher conductivities, higher intensity, and better resolution on SERS and improved anti-aging ability in a 50% relative humility, 20% (v/v) O2 atmosphere at 30 °C for 60 days.

UR - http://www.scopus.com/inward/record.url?scp=0141937890&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0141937890&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0141937890

VL - 107

SP - 9802

EP - 9807

JO - Journal of Physical Chemistry B Materials

JF - Journal of Physical Chemistry B Materials

SN - 1520-6106

IS - 36

ER -