Self-Aligned Deposition Process for Ultrathin Electroless Barriers and Copper Films on Low-k Dielectric Films

G. S. Chen, S. T. Chen, R. F. Louh, T. J. Yang, C. K. Lin

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5 引文 斯高帕斯(Scopus)

指紋 深入研究「Self-Aligned Deposition Process for Ultrathin Electroless Barriers and Copper Films on Low-k Dielectric Films」主題。共同形成了獨特的指紋。

Engineering & Materials Science

Chemical Compounds

Physics & Astronomy