Resin flow characteristics of underfill process on flip chip encapsulation

Engineering & Materials Science

• Encapsulation 97%
• Resins 76%
• Incompressible flow 52%
• Flow visualization 48%
• Computer simulation 46%
• Soldering alloys 41%
• Semiconductor materials 37%
• Temperature 34%
• Experiments 30%
• Costs 16%

Physics & Astronomy

• flow characteristics 100%
• resins 85%
• chips 67%
• injection 62%
• incompressible flow 11%
• simulation 10%
• flow visualization 10%
• solders 10%
• inertia 9%
• balls 8%
• costs 7%
• products 6%
• temperature 5%

Chemical Compounds

• Encapsulation 74%
• Flow 55%
• Simulation 54%
• Solder 35%
• Velocity 23%
• Semiconductor 21%
• Pressure 16%
• Time 10%