Resin flow characteristics of underfill process on flip chip encapsulation

Y.K. Shen, C.M. Ju, Y.J. Shie, H.W. Chien

研究成果: 雜誌貢獻文章

10 引文 斯高帕斯(Scopus)

摘要

Flip chip package is the most important technology in IC package for the necessary of scale, velocity and cost by the development of semiconductor technology and the innovation of computer product. This paper indicates that the analysis for flow visualization of the solder ball and chip between numerical simulation and experiment. A finite element simulation of moving boundaries in a three-dimensional inertia-free, incompressible flow is presented. The injection situation uses for one line injection, L line injection, U line injection and central point injection location. The injection process uses for different parameters (mold temperature, injection temperature, injection pressure, injection time). The results show that the filling situation for numerical simulation is closer to experiment.
原文英語
頁(從 - 到)1075-1084
頁數10
期刊International Communications in Heat and Mass Transfer
31
發行號8
DOIs
出版狀態已發佈 - 2004

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