Nanostructured TaN(O)/TaN barrier film formed by oxygen plasma treatment for copper interconnect

Keng Liang Ou, Ming Hong Lin, Shi Yung Chiou

研究成果: 雜誌貢獻文章同行評審

6 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Physics & Astronomy

Chemical Compounds