Microfluidic chip fabrication using hot embossing and thermal bonding of cop

Boe Yu Pemg, Chih Wei Wu, Yung Kang Shen, Yi Lin

研究成果: 雜誌貢獻文章

21 引文 (Scopus)

摘要

The application of silicon mold inserts by micro-hot embossing molding has been explored in microfluidic chip fabrication. For the mold insert, this study employed an SU-8 photoresist to coat the silicon wafer. Ultraviolet light was then used to expose the pattern on the SU-8 photoresist surface. This study replicates the microstructure of the silicon mold insert by micro-hot embossing molding. Different processing parameters (embossing temperature, embossing pressure, embossing time, and de-molding temperature) for the cycle-olefin polymer (COP) film of microfluidic chips are evaluated. The results showed that the most important parameter for replication of molded microfluidic chip is embossing temperature. De-molding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The microchannel is bonded with a cover by thermal bonding processing to form the sealed microfluidic chip. The bonding temperature is the most important factor in the bonding strength of the sealed microfluidic chip.
原文英語
頁(從 - 到)457-466
頁數10
期刊Polymers for Advanced Technologies
21
發行號7
DOIs
出版狀態已發佈 - 七月 2010

指紋

Microfluidics
Molding
Fabrication
Die casting inserts
Silicon
Photoresists
Temperature
Alkenes
Processing
Microchannels
Silicon wafers
Polymer films
Olefins
Hot Temperature
Surface roughness
Microstructure

ASJC Scopus subject areas

  • Polymers and Plastics

引用此文

Microfluidic chip fabrication using hot embossing and thermal bonding of cop. / Pemg, Boe Yu; Wu, Chih Wei; Shen, Yung Kang; Lin, Yi.

於: Polymers for Advanced Technologies, 卷 21, 編號 7, 07.2010, p. 457-466.

研究成果: 雜誌貢獻文章

@article{7a1d3b658f4249ce9756ae93b75be0e0,
title = "Microfluidic chip fabrication using hot embossing and thermal bonding of cop",
abstract = "The application of silicon mold inserts by micro-hot embossing molding has been explored in microfluidic chip fabrication. For the mold insert, this study employed an SU-8 photoresist to coat the silicon wafer. Ultraviolet light was then used to expose the pattern on the SU-8 photoresist surface. This study replicates the microstructure of the silicon mold insert by micro-hot embossing molding. Different processing parameters (embossing temperature, embossing pressure, embossing time, and de-molding temperature) for the cycle-olefin polymer (COP) film of microfluidic chips are evaluated. The results showed that the most important parameter for replication of molded microfluidic chip is embossing temperature. De-molding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The microchannel is bonded with a cover by thermal bonding processing to form the sealed microfluidic chip. The bonding temperature is the most important factor in the bonding strength of the sealed microfluidic chip.",
keywords = "Bonding strength, EDS, Microfluidic chip, Replication, Surface roughness",
author = "Pemg, {Boe Yu} and Wu, {Chih Wei} and Shen, {Yung Kang} and Yi Lin",
year = "2010",
month = "7",
doi = "10.1002/pat.1447",
language = "English",
volume = "21",
pages = "457--466",
journal = "Polymers for Advanced Technologies",
issn = "1042-7147",
publisher = "Wiley Online Library",
number = "7",

}

TY - JOUR

T1 - Microfluidic chip fabrication using hot embossing and thermal bonding of cop

AU - Pemg, Boe Yu

AU - Wu, Chih Wei

AU - Shen, Yung Kang

AU - Lin, Yi

PY - 2010/7

Y1 - 2010/7

N2 - The application of silicon mold inserts by micro-hot embossing molding has been explored in microfluidic chip fabrication. For the mold insert, this study employed an SU-8 photoresist to coat the silicon wafer. Ultraviolet light was then used to expose the pattern on the SU-8 photoresist surface. This study replicates the microstructure of the silicon mold insert by micro-hot embossing molding. Different processing parameters (embossing temperature, embossing pressure, embossing time, and de-molding temperature) for the cycle-olefin polymer (COP) film of microfluidic chips are evaluated. The results showed that the most important parameter for replication of molded microfluidic chip is embossing temperature. De-molding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The microchannel is bonded with a cover by thermal bonding processing to form the sealed microfluidic chip. The bonding temperature is the most important factor in the bonding strength of the sealed microfluidic chip.

AB - The application of silicon mold inserts by micro-hot embossing molding has been explored in microfluidic chip fabrication. For the mold insert, this study employed an SU-8 photoresist to coat the silicon wafer. Ultraviolet light was then used to expose the pattern on the SU-8 photoresist surface. This study replicates the microstructure of the silicon mold insert by micro-hot embossing molding. Different processing parameters (embossing temperature, embossing pressure, embossing time, and de-molding temperature) for the cycle-olefin polymer (COP) film of microfluidic chips are evaluated. The results showed that the most important parameter for replication of molded microfluidic chip is embossing temperature. De-molding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The microchannel is bonded with a cover by thermal bonding processing to form the sealed microfluidic chip. The bonding temperature is the most important factor in the bonding strength of the sealed microfluidic chip.

KW - Bonding strength

KW - EDS

KW - Microfluidic chip

KW - Replication

KW - Surface roughness

UR - http://www.scopus.com/inward/record.url?scp=77954487849&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77954487849&partnerID=8YFLogxK

U2 - 10.1002/pat.1447

DO - 10.1002/pat.1447

M3 - Article

AN - SCOPUS:77954487849

VL - 21

SP - 457

EP - 466

JO - Polymers for Advanced Technologies

JF - Polymers for Advanced Technologies

SN - 1042-7147

IS - 7

ER -