Microfluidic chip fabrication for silicon mold insert by micro hot embossing

Yung Hsun Shih, Yung Kang Shen, Yi Lin, Jeou Long Lee, Chon Ta Lin, Chien Pang Lee, Ming Wei Wu

研究成果: 書貢獻/報告類型會議貢獻

3 引文 斯高帕斯(Scopus)

摘要

This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.
原文英語
主出版物標題3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS
頁面690-693
頁數4
DOIs
出版狀態已發佈 - 2008
事件3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, 中国
持續時間: 一月 6 2008一月 9 2008

其他

其他3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
國家中国
城市Sanya
期間1/6/081/9/08

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • 引用此

    Shih, Y. H., Shen, Y. K., Lin, Y., Lee, J. L., Lin, C. T., Lee, C. P., & Wu, M. W. (2008). Microfluidic chip fabrication for silicon mold insert by micro hot embossing. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS (頁 690-693). [4484423] https://doi.org/10.1109/NEMS.2008.4484423