Microfluidic chip fabrication for silicon mold insert by micro hot embossing

Yung Hsun Shih; Yung Kang Shen; Yi Lin; Jeou Long Lee; Chon Ta Lin; Chien Pang Lee; Ming Wei Wu

doi:10.1109/NEMS.2008.4484423

Microfluidic chip fabrication for silicon mold insert by micro hot embossing

Yung Hsun Shih, Yung Kang Shen, Yi Lin, Jeou Long Lee, Chon Ta Lin, Chien Pang Lee, Ming Wei Wu

研究成果: 書貢獻/報告類型 › 會議貢獻

3 引文斯高帕斯（Scopus）

摘要

This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.

原文	英語
主出版物標題	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS
頁面	690-693
頁數	4
DOIs	https://doi.org/10.1109/NEMS.2008.4484423
出版狀態	已發佈 - 2008
事件	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, 中国持續時間: 一月 6 2008 → 一月 9 2008

其他

其他	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
國家	中国
城市	Sanya
期間	1/6/08 → 1/9/08

ASJC Scopus subject areas

Control and Systems Engineering
Electrical and Electronic Engineering

存取文件

10.1109/NEMS.2008.4484423

指紋深入研究「Microfluidic chip fabrication for silicon mold insert by micro hot embossing」主題。共同形成了獨特的指紋。

引用此

Shih, Y. H., Shen, Y. K., Lin, Y., Lee, J. L., Lin, C. T., Lee, C. P., & Wu, M. W. (2008). Microfluidic chip fabrication for silicon mold insert by micro hot embossing. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS (頁 690-693). [4484423] https://doi.org/10.1109/NEMS.2008.4484423

Shih, YH , Shen, YK, Lin, Y, Lee, JL, Lin, CT, Lee, CP & Wu, MW 2008, Microfluidic chip fabrication for silicon mold insert by micro hot embossing. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS., 4484423, 頁 690-693, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008, Sanya, 中国, 1/6/08. https://doi.org/10.1109/NEMS.2008.4484423

@inproceedings{75299049a8cb4983b91b45608f41d2fb,

title = "Microfluidic chip fabrication for silicon mold insert by micro hot embossing",

abstract = "This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.",

author = "Shih, {Yung Hsun} and Shen, {Yung Kang} and Yi Lin and Lee, {Jeou Long} and Lin, {Chon Ta} and Lee, {Chien Pang} and Wu, {Ming Wei}",

year = "2008",

doi = "10.1109/NEMS.2008.4484423",

language = "English",

isbn = "9781424419081",

pages = "690--693",

booktitle = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS",

note = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 ; Conference date: 06-01-2008 Through 09-01-2008",

}

TY - GEN

T1 - Microfluidic chip fabrication for silicon mold insert by micro hot embossing

AU - Shih, Yung Hsun

AU - Shen, Yung Kang

AU - Lin, Yi

AU - Lee, Jeou Long

AU - Lin, Chon Ta

AU - Lee, Chien Pang

AU - Wu, Ming Wei

PY - 2008

Y1 - 2008

N2 - This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.

AB - This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.

UR - http://www.scopus.com/inward/record.url?scp=50249093372&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=50249093372&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2008.4484423

DO - 10.1109/NEMS.2008.4484423

M3 - Conference contribution

AN - SCOPUS:50249093372

SN - 9781424419081

SP - 690

EP - 693

BT - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS

T2 - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008

Y2 - 6 January 2008 through 9 January 2008

ER -