摘要
This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.
原文 | 英語 |
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主出版物標題 | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS |
頁面 | 690-693 |
頁數 | 4 |
DOIs | |
出版狀態 | 已發佈 - 2008 |
事件 | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, 中国 持續時間: 1月 6 2008 → 1月 9 2008 |
其他
其他 | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 |
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國家/地區 | 中国 |
城市 | Sanya |
期間 | 1/6/08 → 1/9/08 |
ASJC Scopus subject areas
- 控制與系統工程
- 電氣與電子工程