Microfluidic chip fabrication by micro-powder blasting

Yung Hsun Shih, Yung Kang Shen, Yi Lin, Keng Liang Ou, Rong Hong Hong, Sung Chih Hsu

研究成果: 書貢獻/報告類型會議貢獻

1 引文 (Scopus)

摘要

Micro-powder blasting uses the high speed gas flow which mixed the micro-particle and gas to impact the brittle substrate by the specialized nozzle. This research combined various diameters Al2O3 eroding particle with a novel masking technique to fabricate the pattern channels in soda glass with a width down to 50 μm and depth down to 90 μm The masking technology is consisted by the combination of two polymers:1) the brittle epoxy resin SU-8 for its photosensitivity and 2) The elastic and thermal-curable poly-(dimethyl siloxane) (PDMS) for its erosion resistance. This research uses the different processing parameters (gas pressure, nozzle/substrate distance, particle size, impact angle, and erosion erosion time) to find the optimal process by single-parameter method. The results show that the micro-channel becomes deeper as the gas pressure increases. The micro-channel decreases the depth as the nozzle/substrate distance increases. The surface roughness of micro-channel of microfluidic chip is about 5-6 μm.
原文英語
主出版物標題3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS
頁面780-783
頁數4
DOIs
出版狀態已發佈 - 2008
事件3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, 中国
持續時間: 一月 6 2008一月 9 2008

其他

其他3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
國家中国
城市Sanya
期間1/6/081/9/08

指紋

Blasting
Microfluidics
Erosion
Nozzles
Powders
Fabrication
Substrates
Gases
Photosensitivity
Epoxy resins
Flow of gases
Surface roughness
Particle size
Glass
Polymers
Processing

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

引用此文

Shih, Y. H., Shen, Y. K., Lin, Y., Ou, K. L., Hong, R. H., & Hsu, S. C. (2008). Microfluidic chip fabrication by micro-powder blasting. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS (頁 780-783). [4484442] https://doi.org/10.1109/NEMS.2008.4484442

Microfluidic chip fabrication by micro-powder blasting. / Shih, Yung Hsun; Shen, Yung Kang; Lin, Yi; Ou, Keng Liang; Hong, Rong Hong; Hsu, Sung Chih.

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS. 2008. p. 780-783 4484442.

研究成果: 書貢獻/報告類型會議貢獻

Shih, YH, Shen, YK, Lin, Y, Ou, KL, Hong, RH & Hsu, SC 2008, Microfluidic chip fabrication by micro-powder blasting. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS., 4484442, 頁 780-783, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008, Sanya, 中国, 1/6/08. https://doi.org/10.1109/NEMS.2008.4484442
Shih YH, Shen YK, Lin Y, Ou KL, Hong RH, Hsu SC. Microfluidic chip fabrication by micro-powder blasting. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS. 2008. p. 780-783. 4484442 https://doi.org/10.1109/NEMS.2008.4484442
Shih, Yung Hsun ; Shen, Yung Kang ; Lin, Yi ; Ou, Keng Liang ; Hong, Rong Hong ; Hsu, Sung Chih. / Microfluidic chip fabrication by micro-powder blasting. 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS. 2008. 頁 780-783
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