Micro-device array LED processes on CMOS/MEMS substrate

Jian Chiun Liou, Wen De Lin

研究成果: 書貢獻/報告類型會議貢獻

2 引文 斯高帕斯(Scopus)

摘要

Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.
原文英語
主出版物標題2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
發行者Institute of Electrical and Electronics Engineers Inc.
頁面776-779
頁數4
ISBN(電子)9781509030590
DOIs
出版狀態已發佈 - 八月 25 2017
對外發佈Yes
事件12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - Los Angeles, 美国
持續時間: 四月 9 2017四月 12 2017

會議

會議12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
國家美国
城市Los Angeles
期間4/9/174/12/17

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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    Liou, J. C., & Lin, W. D. (2017). Micro-device array LED processes on CMOS/MEMS substrate. 於 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 (頁 776-779). [8017133] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2017.8017133