Mechanism of underpotential deposition of metal on conducting polymers

Yu Chuan Liu, Kuang Hsuan Yang, Ming D. Ger

研究成果: 雜誌貢獻文章

31 引文 斯高帕斯(Scopus)

摘要

From the idea of underpotential deposition (UPD), the electrochemically depositing and dissolving processes of copper (Cu) onto and from polypyrrole (PPy) were investigated. A mechanism was proposed to illustrate the whole metallization process. The results indicate that two forms of coppers, valence and elemental ones, can be formed on PPy at a constant cathodic potential. However, only the valence Cu can be left on PPy at the anodic stripping. From the X-ray photoelectron spectroscopy (XPS) and surface-enhanced Raman scattering (SERS) analyses, it is found that the valence Cu is interacted with the pyrrolylium nitrogen, resulting from an electron transfer from the Cu atom to the PPy nitrogen. The effect of the deposition methods of Cu onto PPy on its corresponding property was also discussed.

原文英語
頁(從 - 到)337-345
頁數9
期刊Synthetic Metals
126
發行號2-3
DOIs
出版狀態已發佈 - 二月 14 2002
對外發佈Yes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Polymers and Plastics

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