Interaction of copper(I)-polypyrrole complexes prepared by depositing-dissolving copper onto and from polypyrroles

Y. C. Liu, B. J. Hwang

研究成果: 雜誌貢獻文章同行評審

61 引文 斯高帕斯(Scopus)

摘要

Interaction of copper(I)-polypyrrole (PPy) complexes prepared by dissolving excess bulk Cu from PPy and leaving the Cu+ within PPy was investigated. The Cu-PPy interaction resulting from an electron transfer from the Cu atom to the PPy was determined from surface-enhanced Raman spectroscopy (SERS) and X-ray photoelectron spectroscopy (XPS) analyses. There is one Cu+ for circa 6 pyrrole monomers estimated from the difference of the charges of Cu deposition and dissolution, the dissolving curves of cyclic voltammetry (CV) voltammograms, and the XPS analysis.

原文英語
頁(從 - 到)233-239
頁數7
期刊Thin Solid Films
339
發行號1-2
出版狀態已發佈 - 1999
對外發佈

ASJC Scopus subject areas

  • 表面、塗料和薄膜
  • 凝聚態物理學
  • 表面和介面

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