Integrated Multi-Level CMOS Electrostatic Discharge (MLC-ESD) Protection Medical Ultrasound Chip System

Jian Chiun Liou, Wen De Lin

研究成果: 書貢獻/報告類型會議貢獻

1 引文 斯高帕斯(Scopus)

摘要

This paper describes the advantages of integrating a common Power Clamp with the ability to withstand voltage and save on wafer area. The system chip does not require a power clamp for each input source. It is as long as the system core circuit by electrostatic protection. It can reach normal operation and save as much chip area as possible. The structure of this paper has three main features: (1) electrostatic protection (ESD) circuit common Power Clamp combination (2) T025 process high and low voltage ESD (3) The experiment and results within ESD system. The results of ESD sensitivity passed is-6250V~+6200V for type HBM mode. It is-375V~+375V for type MM mode.
原文英語
主出版物標題Proceedings - 3rd International Conference on Green Technology and Sustainable Development, GTSD 2016
發行者Institute of Electrical and Electronics Engineers Inc.
頁面78-81
頁數4
ISBN(電子)9781509036387
DOIs
出版狀態已發佈 - 十二月 22 2016
對外發佈Yes
事件3rd International Conference on Green Technology and Sustainable Development, GTSD 2016 - Kaohsiung, 臺灣
持續時間: 十一月 24 2016十一月 25 2016

會議

會議3rd International Conference on Green Technology and Sustainable Development, GTSD 2016
國家臺灣
城市Kaohsiung
期間11/24/1611/25/16

ASJC Scopus subject areas

  • Environmental Science (miscellaneous)
  • Environmental Engineering

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