High Cu diffusion resistance in ultrathin multiquasi-amorphous CVD-Ti/TiN_x films

Engineering & Materials Science

• Chemical vapor deposition 100%
• Plasmas 45%
• Chlorine 45%
• Nitridation 38%
• Thermodynamic stability 37%
• Transmission electron microscopy 37%
• Thin films 34%
• Copper 29%
• Titanium 23%
• Amorphous films 19%
• Hydrogen 19%
• Diffusion barriers 18%
• Plasma enhanced chemical vapor deposition 17%
• Sheet resistance 16%
• Microstructure 16%
• Electric Conductivity 13%
• X ray diffraction 12%
• Multilayers 11%
• Nitrogen 11%
• Ions 11%
• Vapors 10%
• Textures 9%
• Silicon 9%
• Substrates 8%
• Metals 7%

Chemical Compounds

• Resistance 54%
• Diffusion 52%
• Liquid Film 41%
• Plasma 38%
• Chlorine 32%
• Thermal Stability 24%
• Transmission Electron Microscopy 24%
• Microstructure 16%
• Diffusion Barrier 15%
• Sheet Resistance 14%
• Deposition Technique 13%
• Hydrogen 12%
• Crystalline Texture 11%
• Electrical Conductivity 9%
• Nitrogen 7%
• X-Ray Diffraction 6%
• Ion 4%

Physics & Astronomy

• vapor deposition 65%
• chlorine 39%
• thermal stability 32%
• copper 26%
• transmission electron microscopy 24%
• titanium 20%
• thin films 18%
• stability tests 17%
• hydrogen 15%
• microstructure 14%
• laminates 11%
• performance 10%
• textures 10%
• vapors 9%
• nitrogen 8%
• electrical resistivity 7%
• silicon 6%
• diffraction 6%
• metals 6%
• ions 5%
• x rays 5%