Fabrication of a large-area silicon mold with microstructures using a novel recombining technique

Chih Wei Wu, Chih Heng Chi, Hung Yin Tsai, Yung Kang Shen

研究成果: 書貢獻/報告類型會議貢獻

摘要

This paper presents an innovative fabrication of a large-area silicon mold with microstructures. Conventional techniques capable of manufacturing a large size mold pose severe challenges in making microstructures. In contrast, semiconductor process is limited in its wafer scale. This paper shows a new approach to achieve a large beyond-wafer-size silicon mold with alignment microstructures using two-direction passive alignment recombining techniques. Anisotropic bulk-micromachining technique, laterally joined of (111) silicon crystal planes, passive-alignment methods are the key to fabricate a large-area silicon mold. The area of each small silicon plate is 2.9cm2. Therefore, four small silicon plates with microstructures were recombined as a large-area square silicon mold. The optical fibers were placed into V-grooves on small silicon plates to make sure of microstructures alignment, minimum tilting and rotation angles between plates during the recombining process. The gap, height difference, and aligning accuracy of microstructures between joined silicon plates were able to achieve 8μm, 0.902μm and 20μm, respectively. Moreover, the rotation and tilting angles could be lowered to 0.0622 degree and 0.002 degree, respectively. Microstructures on the large-area silicon mold are faithfully reproduced by polydimethylsiloxane (PDMS). Finally, a 16.8 cm × 12.6 cm silicon mold was fabricated using twelve 4.2cm × 4.2cm silicon plates. It is believed that the novel technique will give an impact and create a highly value-added technology to the precise mold manufacturing.
原文英語
主出版物標題Key Engineering Materials
頁面213-218
頁數6
443
DOIs
出版狀態已發佈 - 2010
事件9th Asia-Pacific Conference on Materials Processing, APCMP2010 - Sydney, NSW, 澳大利亚
持續時間: 六月 7 2010六月 10 2010

出版系列

名字Key Engineering Materials
443
ISSN(列印)10139826

其他

其他9th Asia-Pacific Conference on Materials Processing, APCMP2010
國家澳大利亚
城市Sydney, NSW
期間6/7/106/10/10

指紋

Silicon
Fabrication
Microstructure
Micromachining
Polydimethylsiloxane
Optical fibers
Semiconductor materials

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

引用此文

Wu, C. W., Chi, C. H., Tsai, H. Y., & Shen, Y. K. (2010). Fabrication of a large-area silicon mold with microstructures using a novel recombining technique. 於 Key Engineering Materials (卷 443, 頁 213-218). (Key Engineering Materials; 卷 443). https://doi.org/10.4028/www.scientific.net/KEM.443.213

Fabrication of a large-area silicon mold with microstructures using a novel recombining technique. / Wu, Chih Wei; Chi, Chih Heng; Tsai, Hung Yin; Shen, Yung Kang.

Key Engineering Materials. 卷 443 2010. p. 213-218 (Key Engineering Materials; 卷 443).

研究成果: 書貢獻/報告類型會議貢獻

Wu, CW, Chi, CH, Tsai, HY & Shen, YK 2010, Fabrication of a large-area silicon mold with microstructures using a novel recombining technique. 於 Key Engineering Materials. 卷 443, Key Engineering Materials, 卷 443, 頁 213-218, 9th Asia-Pacific Conference on Materials Processing, APCMP2010, Sydney, NSW, 澳大利亚, 6/7/10. https://doi.org/10.4028/www.scientific.net/KEM.443.213
Wu CW, Chi CH, Tsai HY, Shen YK. Fabrication of a large-area silicon mold with microstructures using a novel recombining technique. 於 Key Engineering Materials. 卷 443. 2010. p. 213-218. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.443.213
Wu, Chih Wei ; Chi, Chih Heng ; Tsai, Hung Yin ; Shen, Yung Kang. / Fabrication of a large-area silicon mold with microstructures using a novel recombining technique. Key Engineering Materials. 卷 443 2010. 頁 213-218 (Key Engineering Materials).
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