Fabricatiion of 3D microfluidic networks with a hybrid stamp

Yu Chun Kung, Kuo Wei Huang, Y. Yang, Y. J. Fan, Pei Yu Chiou

研究成果: 書貢獻/報告類型會議貢獻

7 引文 斯高帕斯(Scopus)

摘要

We report on a novel methodology for fabricating multilayer, high aspect ratio, 3D microfluidic structures with through-layer vias that can be bonded between two hard substrates. It is realized by using a plastic plate embedded PDMS stamp in soft lithography to obtain flat and open PDMS structures that can be stacked to form multiplayer 3D microfluidic networks in high yield without severe structure distortion. Our method also allows the control of the curvature of the channel sidewalls and the shape of channel cross section that may open up profound applications in electrokinetics, microoptics, and inertia microfluidics.
原文英語
主出版物標題IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
頁面915-918
頁數4
DOIs
出版狀態已發佈 - 2013
對外發佈Yes
事件IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, 臺灣
持續時間: 一月 20 2013一月 24 2013

會議

會議IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
國家臺灣
城市Taipei
期間1/20/131/24/13

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • 引用此

    Kung, Y. C., Huang, K. W., Yang, Y., Fan, Y. J., & Chiou, P. Y. (2013). Fabricatiion of 3D microfluidic networks with a hybrid stamp. 於 IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 (頁 915-918). [6474393] https://doi.org/10.1109/MEMSYS.2013.6474393