Evaluation of radio-frequency sputter-deposited textured TiN thin films as diffusion barriers between copper and silicon

G. S. Chen, J. J. Guo, C. K. Lin, Chen Sheng Hsu, L. C. Yang, J. S. Fang

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49 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Physics & Astronomy

Chemical Compounds