Design and fabrication of identification inkjet print head chip fuse sensors

Jian Chiun Liou, Cheng Fu Yang, Cihun Siyong Gong

研究成果: 雜誌貢獻文章同行評審

3 引文 斯高帕斯(Scopus)

摘要

This paper describes the development of a thermal inkjet print head with an identification circuit. The identification circuit was designed using a fuse and other electronic components. The multifunctionality of the integrated circuit in a print head of the cartridge was used to satisfy user demands. The circuit was encoded to enable identification of general information regarding the ink cartridge, such as its model number, serial number, color settings (color or gray scale), and the best print quality. In addition, the current status of the cartridge, such as whether its life has elapsed, can be identiied. The identification circuit was connected in series with the metal oxide semiconductor (MOS) drain fuse after the wafer factory burn break fuse. A VID of more than 3.6 V indicates a blown fuse. Therefore, the fuse-blow voltage was set to be 3.6 V. At a value of VGS equal to 15.5 V, blown fuse parameter analysis was performed. Linear regression showed that the ID current was 54.36 mA. X-ray diffraction patterns revealed that the X-rays penetrate the fuse circuit from the top. Therefore, the elemental composition of all layers, from the upper layer SiC/SiN to the Si substrate, was analyzed and determined to be Si, C, N, Ta, Al, P, and O, among others. Because most layers contain Si, the Si peak was the largest. The fuse profile was characterized using scanning electron microscopy. Fuse size and current density were also investigated.
原文英語
頁(從 - 到)493-501
頁數9
期刊Sensors and Materials
28
發行號5
DOIs
出版狀態已發佈 - 2016
對外發佈Yes

ASJC Scopus subject areas

  • Materials Science(all)
  • Instrumentation

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