Chemical evidences for the optimal coagulant dosage and pH adjustment of silica removal from chemical mechanical polishing (CMP) wastewater

Wen Hui Kuan, Ching Yao Hu

研究成果: 雜誌貢獻文章

17 引文 (Scopus)

摘要

The coagulation behavior of aluminum salts in SiO2(s)-containing chemical mechanical polishing (CMP) wastewater was investigated using jar tests and with reference to the coordination chemistry of Al(III) and Si(IV). The results of the jar tests show that the alum dosage did not influence the removal of silica when more than a particular amount of coagulant was added. However, the removal efficiency of the CMP wastewater depended more strongly on pH than on coagulant dosage. Insight into these results was given by the surface complexation model/surface precipitation model (SCM/SPM) and electrophoresis measurements. Simulation results thus obtained demonstrate that the Al(III) released from the coagulant underwent a two-stage reaction in a narrow range of 1.5 pH under under-saturated solution conditions with respect to the Al-hydroxide solid phase. At low pH (3.5-4.3), the Al(III) prevents the natural dissolution of SiO2(s) particles by forming bi-nuclear surface complexes which energetically disfavor the simultaneous removal of two metal centers. In the pH range 4.3-5, the surface precipitation reaction dominated, and both Al(III) and Si(IV) formed a new oxide film in the original surface, protecting against dissolution of SiO2(s) by OH-.

原文英語
頁(從 - 到)1-7
頁數7
期刊Colloids and Surfaces A: Physicochemical and Engineering Aspects
342
發行號1-3
DOIs
出版狀態已發佈 - 六月 15 2009

指紋

Coagulants
Chemical mechanical polishing
polishing
Silicon Dioxide
Wastewater
adjusting
Silica
silicon dioxide
dosage
dissolving
Dissolution
alum
coagulation
electrophoresis
Coagulation
Electrophoresis
Complexation
Aluminum
hydroxides
Oxide films

ASJC Scopus subject areas

  • Colloid and Surface Chemistry

引用此文

@article{456ad2e8d7e748118c158c013dd1fe2f,
title = "Chemical evidences for the optimal coagulant dosage and pH adjustment of silica removal from chemical mechanical polishing (CMP) wastewater",
abstract = "The coagulation behavior of aluminum salts in SiO2(s)-containing chemical mechanical polishing (CMP) wastewater was investigated using jar tests and with reference to the coordination chemistry of Al(III) and Si(IV). The results of the jar tests show that the alum dosage did not influence the removal of silica when more than a particular amount of coagulant was added. However, the removal efficiency of the CMP wastewater depended more strongly on pH than on coagulant dosage. Insight into these results was given by the surface complexation model/surface precipitation model (SCM/SPM) and electrophoresis measurements. Simulation results thus obtained demonstrate that the Al(III) released from the coagulant underwent a two-stage reaction in a narrow range of 1.5 pH under under-saturated solution conditions with respect to the Al-hydroxide solid phase. At low pH (3.5-4.3), the Al(III) prevents the natural dissolution of SiO2(s) particles by forming bi-nuclear surface complexes which energetically disfavor the simultaneous removal of two metal centers. In the pH range 4.3-5, the surface precipitation reaction dominated, and both Al(III) and Si(IV) formed a new oxide film in the original surface, protecting against dissolution of SiO2(s) by OH-.",
keywords = "Chemical mechanical polishing (CMP), Coagulant dosage, pH, SiO, Surface complexation model/surface precipitation model (SCM/SPM)",
author = "Kuan, {Wen Hui} and Hu, {Ching Yao}",
year = "2009",
month = "6",
day = "15",
doi = "10.1016/j.colsurfa.2009.03.019",
language = "English",
volume = "342",
pages = "1--7",
journal = "Colloids and Surfaces A: Physicochemical and Engineering Aspects",
issn = "0927-7757",
publisher = "Elsevier",
number = "1-3",

}

TY - JOUR

T1 - Chemical evidences for the optimal coagulant dosage and pH adjustment of silica removal from chemical mechanical polishing (CMP) wastewater

AU - Kuan, Wen Hui

AU - Hu, Ching Yao

PY - 2009/6/15

Y1 - 2009/6/15

N2 - The coagulation behavior of aluminum salts in SiO2(s)-containing chemical mechanical polishing (CMP) wastewater was investigated using jar tests and with reference to the coordination chemistry of Al(III) and Si(IV). The results of the jar tests show that the alum dosage did not influence the removal of silica when more than a particular amount of coagulant was added. However, the removal efficiency of the CMP wastewater depended more strongly on pH than on coagulant dosage. Insight into these results was given by the surface complexation model/surface precipitation model (SCM/SPM) and electrophoresis measurements. Simulation results thus obtained demonstrate that the Al(III) released from the coagulant underwent a two-stage reaction in a narrow range of 1.5 pH under under-saturated solution conditions with respect to the Al-hydroxide solid phase. At low pH (3.5-4.3), the Al(III) prevents the natural dissolution of SiO2(s) particles by forming bi-nuclear surface complexes which energetically disfavor the simultaneous removal of two metal centers. In the pH range 4.3-5, the surface precipitation reaction dominated, and both Al(III) and Si(IV) formed a new oxide film in the original surface, protecting against dissolution of SiO2(s) by OH-.

AB - The coagulation behavior of aluminum salts in SiO2(s)-containing chemical mechanical polishing (CMP) wastewater was investigated using jar tests and with reference to the coordination chemistry of Al(III) and Si(IV). The results of the jar tests show that the alum dosage did not influence the removal of silica when more than a particular amount of coagulant was added. However, the removal efficiency of the CMP wastewater depended more strongly on pH than on coagulant dosage. Insight into these results was given by the surface complexation model/surface precipitation model (SCM/SPM) and electrophoresis measurements. Simulation results thus obtained demonstrate that the Al(III) released from the coagulant underwent a two-stage reaction in a narrow range of 1.5 pH under under-saturated solution conditions with respect to the Al-hydroxide solid phase. At low pH (3.5-4.3), the Al(III) prevents the natural dissolution of SiO2(s) particles by forming bi-nuclear surface complexes which energetically disfavor the simultaneous removal of two metal centers. In the pH range 4.3-5, the surface precipitation reaction dominated, and both Al(III) and Si(IV) formed a new oxide film in the original surface, protecting against dissolution of SiO2(s) by OH-.

KW - Chemical mechanical polishing (CMP)

KW - Coagulant dosage

KW - pH

KW - SiO

KW - Surface complexation model/surface precipitation model (SCM/SPM)

UR - http://www.scopus.com/inward/record.url?scp=65549145415&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=65549145415&partnerID=8YFLogxK

U2 - 10.1016/j.colsurfa.2009.03.019

DO - 10.1016/j.colsurfa.2009.03.019

M3 - Article

AN - SCOPUS:65549145415

VL - 342

SP - 1

EP - 7

JO - Colloids and Surfaces A: Physicochemical and Engineering Aspects

JF - Colloids and Surfaces A: Physicochemical and Engineering Aspects

SN - 0927-7757

IS - 1-3

ER -