Barrier capability of Hf-N films with various nitrogen concentrations against copper diffusion in Cu/Hf-N/n+-p junction diodes

Keng Liang Ou, Shi Yung Chiou, Ming Hongn Lin, Ray Quan Hsu

研究成果: 雜誌貢獻 › 文章 › 同行評審

9 引文 斯高帕斯（Scopus）

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Physics & Astronomy

Engineering & Materials Science

Chemical Compounds