Analysis of the mold filling process on flip chip package

Y. K. Shen, S. H. Chen, H. C. Lee

研究成果: 雜誌貢獻文章

7 引文 斯高帕斯(Scopus)

摘要

Flip chip package is the most important technology in IC package in terms of scale, velocity and cost in the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. This paper describes the analysis package of the solder ball and microchip for mold flow simulation (3D, midplane) and experiment. The numerical simulation of mold filling process is based on the concept of control volume finite element method. The injection point uses the corner, 1/4 side and central injection location. The injection process uses different parameters (mold temperature, injection temperature, injection pressure and injection time). For processing situation, the best result is from central injection, then 1/4 side injection and then corner injection. The results also show that the filling situation for 3D numerical simulation is closer to experiment.
原文英語
頁(從 - 到)407-428
頁數22
期刊Journal of Reinforced Plastics and Composites
23
發行號4
出版狀態已發佈 - 2004
對外發佈Yes

ASJC Scopus subject areas

  • Ceramics and Composites
  • Polymers and Plastics
  • Materials Chemistry

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