Analysis for optimal gate design of thin-walled injection molding

Yung Kang Shen, Chih Wei Wu, Ya Feng Yu, Hung Wei Chung

研究成果: 雜誌貢獻文章

20 引文 斯高帕斯(Scopus)

摘要

The 3C (Computer, Communication and Consumer) product has the properties of being light, thin, short and small. In this study, numerical simulations of three-dimensional injection molding are used for thin-walled product. The governing differential equations are discredited by using control volume finite element method. This research points out the processing phenomenon of electronic dictionary battery covers in thin-walled injection molding. This research emphasizes the gate design of thin-walled injection molding for PC+ABS materials. The results show that the gate for single point of two sides is suitable on thin-walled injection molding by numerical simulation. The results also show that the processing is very well for thin-walled injection molding by numerical simulation.
原文英語
頁(從 - 到)728-734
頁數7
期刊International Communications in Heat and Mass Transfer
35
發行號6
DOIs
出版狀態已發佈 - 七月 2008

    指紋

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Mechanical Engineering

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