With the rapidly advancing semiconductor technology and competitive business conditions, it is very crucial to maintain high operation efficiency and maximize the key product throughput to supply market in a timely manner. Dynamic WIP (Work in Process) Dispatching is a new technology to efficiently dispatch semiconductor manufacturing materials to desired tools for lot process promptly in response to dynamically changing operational and business needs. This paper will describes how dynamic WIP dispatching capabilities are built on the next generation Manufacturing Execution System in Intel's manufacturing facilities, and employed in advanced 300mm factories to significantly reduce throughput times, inventory levels, and labor overhead.
|頁（從 - 到）||39-42|
|期刊||IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings|
|出版狀態||已發佈 - 十二月 15 2005|
|事件||IEEE International Symposium on Semiconductor Manufacturing, Conference Proceedings - San Jose, CA, 美国|
持續時間: 九月 13 2005 → 九月 15 2005
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
Li, B., Wu, J., Herring, M. P., & Mouli, C. (2005). A breakthrough in optimizing throughput and manufacturing efficiency via factory-wide Dynamic WIP dispatching in 300mm semiconductor manufacturing. IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings, 39-42. [MC276].