A breakthrough in optimizing throughput and manufacturing efficiency via factory-wide Dynamic WIP dispatching in 300mm semiconductor manufacturing

Bo Li, Johnny Wu, Michael P. Herring, Chandra Mouli

研究成果: 雜誌貢獻Conference article

1 引文 斯高帕斯(Scopus)

摘要

With the rapidly advancing semiconductor technology and competitive business conditions, it is very crucial to maintain high operation efficiency and maximize the key product throughput to supply market in a timely manner. Dynamic WIP (Work in Process) Dispatching is a new technology to efficiently dispatch semiconductor manufacturing materials to desired tools for lot process promptly in response to dynamically changing operational and business needs. This paper will describes how dynamic WIP dispatching capabilities are built on the next generation Manufacturing Execution System in Intel's manufacturing facilities, and employed in advanced 300mm factories to significantly reduce throughput times, inventory levels, and labor overhead.
原文英語
文章編號MC276
頁(從 - 到)39-42
頁數4
期刊IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
出版狀態已發佈 - 十二月 15 2005
對外發佈Yes
事件IEEE International Symposium on Semiconductor Manufacturing, Conference Proceedings - San Jose, CA, 美国
持續時間: 九月 13 2005九月 15 2005

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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