Treating chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation process with surfactant

C. Y. Hu, S. L. Lo, C. M. Li, W. H. Kuan

Research output: Contribution to journalArticle

42 Citations (Scopus)

Abstract

The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in this study to compare the effect of cationic (CTAB) and anodic (SDS) surfactants on ECF. The cationic surfactant can enhance the removal of the turbidity, but anodic surfactant cannot. It can be explained by the hetero-coagulation theory. Moreover, the addition of CTAB in CMP wastewater can reduce the sludge volume and the flotation/sedimentation time in ECF process. The residual turbidity and dissolved silicon dropped with the increase of charge loading. No CTAB pollution problem exists after the ECF process.

Original languageEnglish
Pages (from-to)15-20
Number of pages6
JournalJournal of Hazardous Materials
Volume120
Issue number1-3
DOIs
Publication statusPublished - Apr 11 2005
Externally publishedYes

Keywords

  • Chemical mechanical polishing wastewater
  • Electro-coagulation- flotation process
  • Surfactant

ASJC Scopus subject areas

  • Chemical Health and Safety
  • Process Chemistry and Technology
  • Safety, Risk, Reliability and Quality
  • Environmental Engineering

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