Three-dimensional simulation of flip chip encapsulation process

Y. K. Shen, H. C. Lee

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Flip chip package is the most important technology in IC package for the necessary of scale, velocity and cost by the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. This paper indicates that the analysis for package of the solder ball and chip. A finite element simulation of moving boundaries in a three-dimensional inertia-free, incompressible flow is presented. A control volume scheme with a fixed finite element mesh is employed to predict fluid front advancement. The epoxy is used for the package material. The injection situation uses for one line injection, L line injection, U line injection and central point injection location. The injection process uses for different parameters (mold temperature, injection temperature, injection pressure, injection time). The results show that the mold temperature is the most factor for processing parameters. It indicates that the L line injection is the best injection situation on flip chip package.

Original languageEnglish
Pages (from-to)961-970
Number of pages10
JournalInternational Communications in Heat and Mass Transfer
Volume29
Issue number7
DOIs
Publication statusPublished - Oct 2002
Externally publishedYes

Fingerprint

Encapsulation
chips
injection
simulation
Incompressible flow
Soldering alloys
Temperature
Costs
Innovation
Semiconductor materials
Fluids
Processing
incompressible flow
solders
inertia
temperature
balls
mesh
costs
fluids

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Mechanical Engineering

Cite this

Three-dimensional simulation of flip chip encapsulation process. / Shen, Y. K.; Lee, H. C.

In: International Communications in Heat and Mass Transfer, Vol. 29, No. 7, 10.2002, p. 961-970.

Research output: Contribution to journalArticle

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