The effect on the microstructures of electroless nickel coatings initiated by pulsating electric current

Chung Kwei Lin, Hsien T. Hsu, Chin T. Chen, Tsong J. Yang

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

In this study, pulsating electric current was applied during the electroless Ni plating process. The applied current is controlled to avoid the formation of an immersion (displacement) deposit. The effects of the current density (0.5 and 1.0 A/dm2), duty cycle (0 to 100%, in a step of 10%), and bath pH value (4.4 and 4.8) were investigated systematically. The as-plated coatings were examined by atomic force microscopy, transmission electron microscopy, X-ray diffraction, synchrotron X-ray absorption spectroscopy, etc. Amorphous or amorphous-like microstructure was obtained for all as-plated coatings and the phosphorus content was higher than 8.9 wt.%. Experimental results showed that pulsating electric current can initiate Ni nanocrystallization (∼ 5 nm), improve crystal growth, and accelerate electroless Ni deposition. An obvious increase in deposition rate was also observed with pulsating electric current.

Original languageEnglish
Pages (from-to)355-359
Number of pages5
JournalThin Solid Films
Volume516
Issue number2-4
DOIs
Publication statusPublished - Dec 3 2007
Externally publishedYes

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Keywords

  • Electroless Ni plating
  • Nanocrystalline coatings
  • Pulsating electric current

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

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