Study on flow visualization of flip chip encapsulation process for numerical simulation

Yung Kang Shen, Shiau Tsuen Huang, Ching Jung Chen, Shan Yu

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

Flip chip package is the most important technology in IC package necessary for scale, velocity and cost by the development of semiconductor technology and the innovation of computer product. It has the advantages of low cost, low interface and small volume in IC package. This paper emphasizes the analysis for underfill encapsulation between the solder ball and chip. The finite element simulation in a three-dimensional inertia-free, incompressible flow is presented. A control volume scheme with a fixed finite element mesh is employed to predict fluid front advancement. The epoxy is used for the underfill material. The injection situation is used for central point, one line, L line and U line injection. The underfill process is used for different parameters (mold temperature, melt temperature, injection pressure, injection time and injection situation). The results show that the injection situation is the most important factor for processing parameters. The result indicates that the L line injection is the best injection situation for underfill encapsulation of flip chip.

Original languageEnglish
Pages (from-to)151-157
Number of pages7
JournalInternational Communications in Heat and Mass Transfer
Volume33
Issue number2
DOIs
Publication statusPublished - Feb 2006
Externally publishedYes

Fingerprint

flow visualization
Flow visualization
Encapsulation
chips
injection
Incompressible flow
Computer simulation
Soldering alloys
Costs
simulation
Innovation
Semiconductor materials
Temperature
Fluids
Processing
incompressible flow
solders
inertia
balls
mesh

Keywords

  • Free surface
  • Injection situation
  • Underfill

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Mechanical Engineering

Cite this

Study on flow visualization of flip chip encapsulation process for numerical simulation. / Shen, Yung Kang; Huang, Shiau Tsuen; Chen, Ching Jung; Yu, Shan.

In: International Communications in Heat and Mass Transfer, Vol. 33, No. 2, 02.2006, p. 151-157.

Research output: Contribution to journalArticle

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