Self-Aligned Deposition Process for Ultrathin Electroless Barriers and Copper Films on Low-k Dielectric Films

Engineering & Materials Science

• Low-k dielectric 100%
• Dielectric films 99%
• Plasmas 62%
• Hydrogen peroxide 58%
• Copper 54%
• X ray absorption spectroscopy 44%
• Electroless plating 30%
• Atomic force microscopy 28%
• Plating 25%
• Precipitates 23%
• Transmission electron microscopy 23%
• Physics 19%

Chemical Compounds

• Dielectric Film 98%
• Deposition Process 73%
• Plasma 41%
• Hydrogen Peroxide 34%
• Liquid Film 32%
• X Ray Absorption Spectroscopy 23%
• Dielectric Material 19%
• Atomic Force Microscopy 17%
• Transmission Electron Microscopy 14%
• Chemistry 13%
• Aqueous Solution 11%

Physics & Astronomy

• hydrogen peroxide 54%
• plating 49%
• copper 48%
• plasma physics 26%
• pretreatment 24%
• absorption spectroscopy 20%
• aqueous solutions 20%
• precipitates 19%
• chemistry 19%
• atomic force microscopy 17%
• transmission electron microscopy 14%
• high resolution 13%
• x rays 10%