Role of the Hf/Si Interfacial Layer on the High Performance of MoS2-Based Conductive Bridge RAM for Artificial Synapse Application

Sreekanth Ginnaram, Jiantai Timothy Qiu, Siddheswar Maikap

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)


In this letter, we demonstrate the key role of the Hf/Si interfacial layer (IL) in Al/Cu/IL/MoS2/TiN conductive bridge RAM. Owing to controlling Cu migration through Hf rather than Si, the Hf interface device offers consecutive >4000 DC cycles and long program/erase (P/E) endurance of gt; 2\times 10^{9}$ cycles under the low current operation of $100~\mu \text{A}$ at the fast switching speed of 100 ns. The Hf interface device shows gradual RESET, long-term potentiation/depression (LTP/LTD) pulses of 40/100 with small pulse width of 100 ns and a low power consumption of < 13 pJ is needed for artificial synapse applications.

Original languageEnglish
Article number9035621
Pages (from-to)709-712
Number of pages4
JournalIEEE Electron Device Letters
Issue number5
Publication statusPublished - May 2020
Externally publishedYes


  • artificial synapse
  • Hf/Si interfacial layer
  • High-performance
  • MoS₂
  • non-volatile memory

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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