Optimal design of microneedles inserts into skin by numerical simulation

Chui Yu Chiu, Hsin Chuan Kuo, Yi Lin, Jeou Long Lee, Yung Kang Shen, Sheng Jie Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The purpose of this research is to find the optimal design for biodegradable polymer microneedle patches. Based on the mechanical properties of different skin layers and the failure criterion of the material, this research designs a microneedle of four types and three sizes, then discusses the insertion force and the variation of stress during the process of PLA microneedle insertion into skin by numerical simulation. This research uses the dynamic finite element software ANSYS / LS-DYNA to simulate the processing for PLA microneedle inserts into skin. The master microneedle array was fabricated by the MEMS process. This research uses PDMS to fabricate the mould for microneedles. Finally, a biodegradable polymer polylactic acid (PLA) microneedle patch was fabricated using a PDMS mould micro hot embossing method.

Original languageEnglish
Title of host publicationKey Engineering Materials
Pages624-628
Number of pages5
Volume516
DOIs
Publication statusPublished - 2012
Event4th International Conference of Asian Society for Precision Engineering and Nanotechnology, ASPEN 2011 - Hong Kong, China
Duration: Nov 16 2011Nov 18 2011

Publication series

NameKey Engineering Materials
Volume516
ISSN (Print)10139826

Other

Other4th International Conference of Asian Society for Precision Engineering and Nanotechnology, ASPEN 2011
CountryChina
CityHong Kong
Period11/16/1111/18/11

Keywords

  • Numerical simulation
  • Optimal design
  • PLA microneedle

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Chiu, C. Y., Kuo, H. C., Lin, Y., Lee, J. L., Shen, Y. K., & Kang, S. J. (2012). Optimal design of microneedles inserts into skin by numerical simulation. In Key Engineering Materials (Vol. 516, pp. 624-628). (Key Engineering Materials; Vol. 516). https://doi.org/10.4028/www.scientific.net/KEM.516.624