This paper describes our work aimed at developing an integrated multi-dimensional thermal inkjet (TIJ) printhead with data registration CMOS de-multiplexer utilizing bulk micromachining technology (MEMS). In this experiment, we developed a new structural design for chips used in inkjet printheads. We designed a thermal inkjet device, whose dimensions could be adjusted to optimize drop generation performance. The energy conversion device and accompanying system were based on an integrated driver head with the performance of a high-frequency, picoliter drop inkjet. The inkjet featured a smart CMOS circuit including D Flip-Flops signal processes along with bi-directional data transfer and 12 V power amplifiers in a printhead chip. All of the jets of the printhead were controlled by very few input lines, a pulse shape (ENABLE), a data line (DATA), a bit shift clock (BIT SHIFT), a state clearing pulse, 5-volt supply for the logic devices, a higher voltage for energizing the heater resisters, and a ground line. The fabricated backside etching of the thermal inkjet (TIJ) printhead was measured by open pool and closed pool systems. The starting voltage was measured at 6.5 V, and its lifespan was 1.5 × 108.
- Bubble jet
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering