Microstructures and properties of Ag-DLC films prepared by magnetron reactive sputtering

Cui Feng Wang, Shi Yung Chiou, Ya Chen Chang, Keng Liang Ou

Research output: Contribution to journalArticle

Abstract

To clarify the effects of silver (Ag) atom content on antibacterial rate and the performance of silver-containing diamond-like carbon (DLC) films, Ag-DLC films were deposited on the glass using magnetron reactive sputtering. The watt of input energy was applied as main process parameter to obtain 1~2 μm thick films. The basic properties such as hardness, electric resistivity and surface roughness were evaluated by hardness tester, 4 points-probe resistivity tester and atomic force microscope (AFM), respectively. The X-ray diffraction (XRD), scanning electron microscope (SEM), Raman spectroscope and transmission electron microscope (TEM) were used to examine the microstructures and bonding characteristic and growth morphologies of DLC films. Antibacterial test and contact angle test were undertaken to analyze the antibacterial ability of silver-containing DLC films. The results indicate that, with increasing the input power, the thickness, silver content, ID/IG of the films and surface roughness increase, while the hardness and electric resistivity decrease. Antibacterial tests show that, with increasing the input power, the antibacterial ability against E.coli increases. The antibacterial rate of 98% is obtained in the films with 19.77%(atom fraction) silver content when the input power is 200 W.

Original languageEnglish
Pages (from-to)108-115
Number of pages8
JournalFenmo Yejin Cailiao Kexue yu Gongcheng/Materials Science and Engineering of Powder Metallurgy
Volume19
Issue number1
Publication statusPublished - Feb 2014

Keywords

  • Ag-DLC
  • Antibacterial ability
  • Sputtering

ASJC Scopus subject areas

  • Metals and Alloys

Fingerprint Dive into the research topics of 'Microstructures and properties of Ag-DLC films prepared by magnetron reactive sputtering'. Together they form a unique fingerprint.

  • Cite this