Abstract
This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.
Original language | English |
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Title of host publication | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS |
Pages | 690-693 |
Number of pages | 4 |
DOIs | |
Publication status | Published - 2008 |
Event | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China Duration: Jan 6 2008 → Jan 9 2008 |
Other
Other | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 |
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Country/Territory | China |
City | Sanya |
Period | 1/6/08 → 1/9/08 |
ASJC Scopus subject areas
- Control and Systems Engineering
- Electrical and Electronic Engineering