Microfluidic chip fabrication for silicon mold insert by micro hot embossing

Yung Hsun Shih; Yung Kang Shen; Yi Lin; Jeou Long Lee; Chon Ta Lin; Chien Pang Lee; Ming Wei Wu

doi:10.1109/NEMS.2008.4484423

Microfluidic chip fabrication for silicon mold insert by micro hot embossing

Yung Hsun Shih, Yung Kang Shen, Yi Lin, Jeou Long Lee, Chon Ta Lin, Chien Pang Lee, Ming Wei Wu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.

Original language	English
Title of host publication	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS
Pages	690-693
Number of pages	4
DOIs	https://doi.org/10.1109/NEMS.2008.4484423
Publication status	Published - 2008
Event	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China Duration: Jan 6 2008 → Jan 9 2008

Other

Other	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
Country	China
City	Sanya
Period	1/6/08 → 1/9/08

ASJC Scopus subject areas

Control and Systems Engineering
Electrical and Electronic Engineering

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Microfluidic chip fabrication for silicon mold insert by micro hot embossing. / Shih, Yung Hsun ; Shen, Yung Kang; Lin, Yi; Lee, Jeou Long; Lin, Chon Ta; Lee, Chien Pang; Wu, Ming Wei.

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS. 2008. p. 690-693 4484423.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shih, YH , Shen, YK, Lin, Y, Lee, JL, Lin, CT, Lee, CP & Wu, MW 2008, Microfluidic chip fabrication for silicon mold insert by micro hot embossing. in 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS., 4484423, pp. 690-693, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008, Sanya, China, 1/6/08. https://doi.org/10.1109/NEMS.2008.4484423

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title = "Microfluidic chip fabrication for silicon mold insert by micro hot embossing",

abstract = "This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.",

author = "Shih, {Yung Hsun} and Shen, {Yung Kang} and Yi Lin and Lee, {Jeou Long} and Lin, {Chon Ta} and Lee, {Chien Pang} and Wu, {Ming Wei}",

year = "2008",

doi = "10.1109/NEMS.2008.4484423",

language = "English",

isbn = "9781424419081",

pages = "690--693",

booktitle = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS",

note = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 ; Conference date: 06-01-2008 Through 09-01-2008",

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T1 - Microfluidic chip fabrication for silicon mold insert by micro hot embossing

AU - Shih, Yung Hsun

AU - Shen, Yung Kang

AU - Lin, Yi

AU - Lee, Jeou Long

AU - Lin, Chon Ta

AU - Lee, Chien Pang

AU - Wu, Ming Wei

PY - 2008

Y1 - 2008

N2 - This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.

AB - This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.

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AN - SCOPUS:50249093372

SN - 9781424419081

SP - 690

EP - 693

BT - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS

T2 - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008

Y2 - 6 January 2008 through 9 January 2008

ER -

Microfluidic chip fabrication for silicon mold insert by micro hot embossing

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