Microfluidic chip fabrication for silicon mold insert by micro hot embossing

Yung Hsun Shih, Yung Kang Shen, Yi Lin, Jeou Long Lee, Chon Ta Lin, Chien Pang Lee, Ming Wei Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.

Original languageEnglish
Title of host publication3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS
Pages690-693
Number of pages4
DOIs
Publication statusPublished - 2008
Event3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China
Duration: Jan 6 2008Jan 9 2008

Other

Other3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
CountryChina
CitySanya
Period1/6/081/9/08

Fingerprint

Microfluidics
Fabrication
Silicon
Molding
Taguchi methods
Die casting inserts
Lithography
Surface roughness
Temperature
Processing

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Shih, Y. H., Shen, Y. K., Lin, Y., Lee, J. L., Lin, C. T., Lee, C. P., & Wu, M. W. (2008). Microfluidic chip fabrication for silicon mold insert by micro hot embossing. In 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS (pp. 690-693). [4484423] https://doi.org/10.1109/NEMS.2008.4484423

Microfluidic chip fabrication for silicon mold insert by micro hot embossing. / Shih, Yung Hsun; Shen, Yung Kang; Lin, Yi; Lee, Jeou Long; Lin, Chon Ta; Lee, Chien Pang; Wu, Ming Wei.

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS. 2008. p. 690-693 4484423.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Shih, YH, Shen, YK, Lin, Y, Lee, JL, Lin, CT, Lee, CP & Wu, MW 2008, Microfluidic chip fabrication for silicon mold insert by micro hot embossing. in 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS., 4484423, pp. 690-693, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008, Sanya, China, 1/6/08. https://doi.org/10.1109/NEMS.2008.4484423
Shih YH, Shen YK, Lin Y, Lee JL, Lin CT, Lee CP et al. Microfluidic chip fabrication for silicon mold insert by micro hot embossing. In 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS. 2008. p. 690-693. 4484423 https://doi.org/10.1109/NEMS.2008.4484423
Shih, Yung Hsun ; Shen, Yung Kang ; Lin, Yi ; Lee, Jeou Long ; Lin, Chon Ta ; Lee, Chien Pang ; Wu, Ming Wei. / Microfluidic chip fabrication for silicon mold insert by micro hot embossing. 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS. 2008. pp. 690-693
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