Abstract
This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.
| Original language | English |
|---|---|
| Title of host publication | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS |
| Pages | 690-693 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2008 |
| Event | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China Duration: Jan 6 2008 → Jan 9 2008 |
Other
| Other | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 |
|---|---|
| Country | China |
| City | Sanya |
| Period | 1/6/08 → 1/9/08 |
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ASJC Scopus subject areas
- Control and Systems Engineering
- Electrical and Electronic Engineering
Cite this
Microfluidic chip fabrication for silicon mold insert by micro hot embossing. / Shih, Yung Hsun; Shen, Yung Kang; Lin, Yi; Lee, Jeou Long; Lin, Chon Ta; Lee, Chien Pang; Wu, Ming Wei.
3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS. 2008. p. 690-693 4484423.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Microfluidic chip fabrication for silicon mold insert by micro hot embossing
AU - Shih, Yung Hsun
AU - Shen, Yung Kang
AU - Lin, Yi
AU - Lee, Jeou Long
AU - Lin, Chon Ta
AU - Lee, Chien Pang
AU - Wu, Ming Wei
PY - 2008
Y1 - 2008
N2 - This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.
AB - This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.
UR - http://www.scopus.com/inward/record.url?scp=50249093372&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50249093372&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2008.4484423
DO - 10.1109/NEMS.2008.4484423
M3 - Conference contribution
SN - 9781424419081
SP - 690
EP - 693
BT - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS
ER -