Microfluidic chip fabrication for silicon mold insert by micro hot embossing

Yung Hsun Shih; Yung Kang Shen; Yi Lin; Jeou Long Lee; Chon Ta Lin; Chien Pang Lee; Ming Wei Wu

doi:10.1109/NEMS.2008.4484423

Microfluidic chip fabrication for silicon mold insert by micro hot embossing

Yung Hsun Shih, Yung Kang Shen, Yi Lin, Jeou Long Lee, Chon Ta Lin, Chien Pang Lee, Ming Wei Wu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.

Original language	English
Title of host publication	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS
Pages	690-693
Number of pages	4
DOIs	https://doi.org/10.1109/NEMS.2008.4484423
Publication status	Published - 2008
Event	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China Duration: Jan 6 2008 → Jan 9 2008

Other

Other	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
Country	China
City	Sanya
Period	1/6/08 → 1/9/08

ASJC Scopus subject areas

Control and Systems Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/NEMS.2008.4484423

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Cite this

Shih, Y. H., Shen, Y. K., Lin, Y., Lee, J. L., Lin, C. T., Lee, C. P., & Wu, M. W. (2008). Microfluidic chip fabrication for silicon mold insert by micro hot embossing. In 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS (pp. 690-693). [4484423] https://doi.org/10.1109/NEMS.2008.4484423

Microfluidic chip fabrication for silicon mold insert by micro hot embossing. / Shih, Yung Hsun ; Shen, Yung Kang; Lin, Yi; Lee, Jeou Long; Lin, Chon Ta; Lee, Chien Pang; Wu, Ming Wei.

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS. 2008. p. 690-693 4484423.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shih, YH , Shen, YK, Lin, Y, Lee, JL, Lin, CT, Lee, CP & Wu, MW 2008, Microfluidic chip fabrication for silicon mold insert by micro hot embossing. in 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS., 4484423, pp. 690-693, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008, Sanya, China, 1/6/08. https://doi.org/10.1109/NEMS.2008.4484423

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abstract = "This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.",

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