Microfluidic chip fabrication by micro-powder blasting

Yung Hsun Shih, Yung Kang Shen, Yi Lin, Keng Liang Ou, Rong Hong Hong, Sung Chih Hsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Micro-powder blasting uses the high speed gas flow which mixed the micro-particle and gas to impact the brittle substrate by the specialized nozzle. This research combined various diameters Al2O3 eroding particle with a novel masking technique to fabricate the pattern channels in soda glass with a width down to 50 μm and depth down to 90 μm The masking technology is consisted by the combination of two polymers:1) the brittle epoxy resin SU-8 for its photosensitivity and 2) The elastic and thermal-curable poly-(dimethyl siloxane) (PDMS) for its erosion resistance. This research uses the different processing parameters (gas pressure, nozzle/substrate distance, particle size, impact angle, and erosion erosion time) to find the optimal process by single-parameter method. The results show that the micro-channel becomes deeper as the gas pressure increases. The micro-channel decreases the depth as the nozzle/substrate distance increases. The surface roughness of micro-channel of microfluidic chip is about 5-6 μm.

Original languageEnglish
Title of host publication3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS
Pages780-783
Number of pages4
DOIs
Publication statusPublished - 2008
Event3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China
Duration: Jan 6 2008Jan 9 2008

Other

Other3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
CountryChina
CitySanya
Period1/6/081/9/08

    Fingerprint

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Shih, Y. H., Shen, Y. K., Lin, Y., Ou, K. L., Hong, R. H., & Hsu, S. C. (2008). Microfluidic chip fabrication by micro-powder blasting. In 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS (pp. 780-783). [4484442] https://doi.org/10.1109/NEMS.2008.4484442