Microfluidic chip fabrication by micro-powder blasting

Yung Hsun Shih; Yung Kang Shen; Yi Lin; Keng Liang Ou; Rong Hong Hong; Sung Chih Hsu

doi:10.1109/NEMS.2008.4484442

Microfluidic chip fabrication by micro-powder blasting

Yung Hsun Shih, Yung Kang Shen, Yi Lin, Keng Liang Ou, Rong Hong Hong, Sung Chih Hsu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Micro-powder blasting uses the high speed gas flow which mixed the micro-particle and gas to impact the brittle substrate by the specialized nozzle. This research combined various diameters Al₂O₃ eroding particle with a novel masking technique to fabricate the pattern channels in soda glass with a width down to 50 μm and depth down to 90 μm The masking technology is consisted by the combination of two polymers:1) the brittle epoxy resin SU-8 for its photosensitivity and 2) The elastic and thermal-curable poly-(dimethyl siloxane) (PDMS) for its erosion resistance. This research uses the different processing parameters (gas pressure, nozzle/substrate distance, particle size, impact angle, and erosion erosion time) to find the optimal process by single-parameter method. The results show that the micro-channel becomes deeper as the gas pressure increases. The micro-channel decreases the depth as the nozzle/substrate distance increases. The surface roughness of micro-channel of microfluidic chip is about 5-6 μm.

Original language	English
Title of host publication	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS
Pages	780-783
Number of pages	4
DOIs	https://doi.org/10.1109/NEMS.2008.4484442
Publication status	Published - 2008
Event	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China Duration: Jan 6 2008 → Jan 9 2008

Other

Other	3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
Country	China
City	Sanya
Period	1/6/08 → 1/9/08

ASJC Scopus subject areas

Control and Systems Engineering
Electrical and Electronic Engineering

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Shih, YH , Shen, YK, Lin, Y, Ou, KL, Hong, RH & Hsu, SC 2008, Microfluidic chip fabrication by micro-powder blasting. in 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS., 4484442, pp. 780-783, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008, Sanya, China, 1/6/08. https://doi.org/10.1109/NEMS.2008.4484442

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title = "Microfluidic chip fabrication by micro-powder blasting",

abstract = "Micro-powder blasting uses the high speed gas flow which mixed the micro-particle and gas to impact the brittle substrate by the specialized nozzle. This research combined various diameters Al2O3 eroding particle with a novel masking technique to fabricate the pattern channels in soda glass with a width down to 50 μm and depth down to 90 μm The masking technology is consisted by the combination of two polymers:1) the brittle epoxy resin SU-8 for its photosensitivity and 2) The elastic and thermal-curable poly-(dimethyl siloxane) (PDMS) for its erosion resistance. This research uses the different processing parameters (gas pressure, nozzle/substrate distance, particle size, impact angle, and erosion erosion time) to find the optimal process by single-parameter method. The results show that the micro-channel becomes deeper as the gas pressure increases. The micro-channel decreases the depth as the nozzle/substrate distance increases. The surface roughness of micro-channel of microfluidic chip is about 5-6 μm.",

author = "Shih, {Yung Hsun} and Shen, {Yung Kang} and Yi Lin and Ou, {Keng Liang} and Hong, {Rong Hong} and Hsu, {Sung Chih}",

year = "2008",

doi = "10.1109/NEMS.2008.4484442",

language = "English",

isbn = "9781424419081",

pages = "780--783",

booktitle = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS",

note = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 ; Conference date: 06-01-2008 Through 09-01-2008",

}

TY - GEN

T1 - Microfluidic chip fabrication by micro-powder blasting

AU - Shih, Yung Hsun

AU - Shen, Yung Kang

AU - Lin, Yi

AU - Ou, Keng Liang

AU - Hong, Rong Hong

AU - Hsu, Sung Chih

PY - 2008

Y1 - 2008

N2 - Micro-powder blasting uses the high speed gas flow which mixed the micro-particle and gas to impact the brittle substrate by the specialized nozzle. This research combined various diameters Al2O3 eroding particle with a novel masking technique to fabricate the pattern channels in soda glass with a width down to 50 μm and depth down to 90 μm The masking technology is consisted by the combination of two polymers:1) the brittle epoxy resin SU-8 for its photosensitivity and 2) The elastic and thermal-curable poly-(dimethyl siloxane) (PDMS) for its erosion resistance. This research uses the different processing parameters (gas pressure, nozzle/substrate distance, particle size, impact angle, and erosion erosion time) to find the optimal process by single-parameter method. The results show that the micro-channel becomes deeper as the gas pressure increases. The micro-channel decreases the depth as the nozzle/substrate distance increases. The surface roughness of micro-channel of microfluidic chip is about 5-6 μm.

AB - Micro-powder blasting uses the high speed gas flow which mixed the micro-particle and gas to impact the brittle substrate by the specialized nozzle. This research combined various diameters Al2O3 eroding particle with a novel masking technique to fabricate the pattern channels in soda glass with a width down to 50 μm and depth down to 90 μm The masking technology is consisted by the combination of two polymers:1) the brittle epoxy resin SU-8 for its photosensitivity and 2) The elastic and thermal-curable poly-(dimethyl siloxane) (PDMS) for its erosion resistance. This research uses the different processing parameters (gas pressure, nozzle/substrate distance, particle size, impact angle, and erosion erosion time) to find the optimal process by single-parameter method. The results show that the micro-channel becomes deeper as the gas pressure increases. The micro-channel decreases the depth as the nozzle/substrate distance increases. The surface roughness of micro-channel of microfluidic chip is about 5-6 μm.

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DO - 10.1109/NEMS.2008.4484442

M3 - Conference contribution

AN - SCOPUS:50249089675

SN - 9781424419081

SP - 780

EP - 783

BT - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS

T2 - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008

Y2 - 6 January 2008 through 9 January 2008

ER -

Microfluidic chip fabrication by micro-powder blasting

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