Micro-device array LED processes on CMOS/MEMS substrate

Jian Chiun Liou, Wen De Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.

Original languageEnglish
Title of host publication2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages776-779
Number of pages4
ISBN (Electronic)9781509030590
DOIs
Publication statusPublished - Aug 25 2017
Externally publishedYes
Event12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - Los Angeles, United States
Duration: Apr 9 2017Apr 12 2017

Conference

Conference12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
CountryUnited States
CityLos Angeles
Period4/9/174/12/17

Fingerprint

microelectromechanical systems
MEMS
Light emitting diodes
CMOS
light emitting diodes
Substrates
chips
sequencing
chutes
thrust
Display devices
Fabrication
fabrication
Networks (circuits)

Keywords

  • addressing
  • ASIC
  • CMOS/MEMS

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

Cite this

Liou, J. C., & Lin, W. D. (2017). Micro-device array LED processes on CMOS/MEMS substrate. In 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 (pp. 776-779). [8017133] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2017.8017133

Micro-device array LED processes on CMOS/MEMS substrate. / Liou, Jian Chiun; Lin, Wen De.

2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 776-779 8017133.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Liou, JC & Lin, WD 2017, Micro-device array LED processes on CMOS/MEMS substrate. in 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017., 8017133, Institute of Electrical and Electronics Engineers Inc., pp. 776-779, 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017, Los Angeles, United States, 4/9/17. https://doi.org/10.1109/NEMS.2017.8017133
Liou JC, Lin WD. Micro-device array LED processes on CMOS/MEMS substrate. In 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 776-779. 8017133 https://doi.org/10.1109/NEMS.2017.8017133
Liou, Jian Chiun ; Lin, Wen De. / Micro-device array LED processes on CMOS/MEMS substrate. 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 776-779
@inproceedings{85b81d2e81ae4bea9fac988caf93c2bd,
title = "Micro-device array LED processes on CMOS/MEMS substrate",
abstract = "Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.",
keywords = "addressing, ASIC, CMOS/MEMS",
author = "Liou, {Jian Chiun} and Lin, {Wen De}",
year = "2017",
month = "8",
day = "25",
doi = "10.1109/NEMS.2017.8017133",
language = "English",
pages = "776--779",
booktitle = "2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - Micro-device array LED processes on CMOS/MEMS substrate

AU - Liou, Jian Chiun

AU - Lin, Wen De

PY - 2017/8/25

Y1 - 2017/8/25

N2 - Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.

AB - Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.

KW - addressing

KW - ASIC

KW - CMOS/MEMS

UR - http://www.scopus.com/inward/record.url?scp=85030872782&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85030872782&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2017.8017133

DO - 10.1109/NEMS.2017.8017133

M3 - Conference contribution

SP - 776

EP - 779

BT - 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

PB - Institute of Electrical and Electronics Engineers Inc.

ER -