Investigations of adhesion between waveguide and InP-laser with finger structure bonding

Research output: Contribution to journalArticle

Abstract

In this study, we focused on benzocyclobutene (BCB) coatings, finger structure bonding, and adhesion observation. To investigate a microdisk laser operating at a wavelength of 1310 nm, a system involving the use of 2 mm × 2 mm InP laser chips (bonded using divinyl siloxane-BCB through 2 cm × 2 cm hybrid laser processes), silicon-on-insulator wafer waveguides, a processing approach, and investigations based on chip architecture photographs was used. The I-V curve measured under the needle showed the feasibility of laser operation at a current of approximately 30 mA at 1.5 V. The maximum optical power was approximately 2.2 μW at 40 mA.

Original languageEnglish
Pages (from-to)30-37
Number of pages8
JournalComputational Materials Science
Volume122
DOIs
Publication statusPublished - Sep 1 2016
Externally publishedYes

Fingerprint

Adhesion
Waveguide
Waveguides
adhesion
Laser
waveguides
Lasers
lasers
Chip
chips
Siloxanes
Silicon-on-insulator
siloxanes
Silicon
photographs
needles
Needles
Wafer
Coating
insulators

ASJC Scopus subject areas

  • Computer Science(all)
  • Chemistry(all)
  • Materials Science(all)
  • Mechanics of Materials
  • Physics and Astronomy(all)
  • Computational Mathematics

Cite this

Investigations of adhesion between waveguide and InP-laser with finger structure bonding. / Liou, Jian Chiun.

In: Computational Materials Science, Vol. 122, 01.09.2016, p. 30-37.

Research output: Contribution to journalArticle

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