Formation of NiAl-Al2O3 intermetallic-matrix composite powders by mechanical alloying technique

Chung Kwei Lin, Shi Shen Hong, Pee Yew Lee

Research output: Contribution to journalArticle

47 Citations (Scopus)

Abstract

This study investigated the feasibility of preparing intermetallic-matrix composite powders (NiAl/Al2O3) by mechanical alloying of Ni, Al and Al2O3 powder mixtures with various compositions of (NiAl)x(Al2O3)100-x. The as-milled powders were examined by X-ray diffraction, scanning electron microscopy, and differential thermal analysis. The formation of NiAl phase was noticed after 5 h of milling. Intermetallic-matrix composite powders (NiAl/Al2O3) were prepared successfully at the end of milling for (NiAl)x(Al2O3)100-x (x = 79, 66, and 49), but no alumina phase was detected for (NiAl)95(Al2O3)5. It is suspected that the additions of alumina hampered the cold welding and fracturing process. The thermal analysis of (NiAl)x(Al2O3)100-x powders after 1 h of milling revealed that the transition temperature of NiAl phase increased with increasing amount of Al2O3 additions.

Original languageEnglish
Pages (from-to)1043-1048
Number of pages6
JournalIntermetallics
Volume8
Issue number9-11
DOIs
Publication statusPublished - Sep 2000
Externally publishedYes

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Mechanical alloying
Powders
Intermetallics
Composite materials
Aluminum Oxide
Alumina
Cold welding
Differential thermal analysis
Thermoanalysis
Superconducting transition temperature
X ray diffraction
Scanning electron microscopy
Chemical analysis

ASJC Scopus subject areas

  • Metals and Alloys

Cite this

Formation of NiAl-Al2O3 intermetallic-matrix composite powders by mechanical alloying technique. / Lin, Chung Kwei; Hong, Shi Shen; Lee, Pee Yew.

In: Intermetallics, Vol. 8, No. 9-11, 09.2000, p. 1043-1048.

Research output: Contribution to journalArticle

Lin, Chung Kwei ; Hong, Shi Shen ; Lee, Pee Yew. / Formation of NiAl-Al2O3 intermetallic-matrix composite powders by mechanical alloying technique. In: Intermetallics. 2000 ; Vol. 8, No. 9-11. pp. 1043-1048.
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