Formation and characterization of mechanically alloyed Ti-Cu-Ni-Sn bulk metallic glass composites

I. Kuan Jeng, Chung Kwei Lin, Pee Y. Lee

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)

Abstract

In the present study, amorphous Ti50Cu28Ni15Sn7 and its composite powders reinforced with 4, 8, and 12 vol.% of W additions were prepared by mechanical alloying. After 5 h of milling, amorphous powders with homogeneously dispersed W nanoparticles were synthesized. The as-milled Ti50Cu28Ni15Sn7 and composite powders were then consolidated by vacuum hot pressing into disc compacts with a diameter and thickness of 4 and 10 mm, respectively. The structure of the as-milled powders and consolidated compacts was characterized by X-ray diffraction (XRD), scanning electron microscopy, and transmission electron microscopy. While the thermal stability was examined by differential scanning calorimeter (DSC). In addition, the mechanical property of the consolidated BMGs was evaluated by Vickers microhardness tests. The experimental results showed that W nanoparticles ranged from 20 to 200 nm were embedded within the amorphous matrix. The presence of W nanoparticles did not dramatically change the glass formation ability of amorphous Ti50Cu28Ni15Sn7 powders. While the thermal stability of amorphous powders differed from those of its composites. A significant hardness increase with W additions was noticed for consolidated composite compacts.

Original languageEnglish
Pages (from-to)957-961
Number of pages5
JournalIntermetallics
Volume14
Issue number8-9
DOIs
Publication statusPublished - Aug 2006
Externally publishedYes

Keywords

  • A. Composites
  • A. Glasses, metallic
  • B. Mechanical properties at ambient temperature
  • C. Mechanical alloying and milling

ASJC Scopus subject areas

  • Metals and Alloys

Fingerprint Dive into the research topics of 'Formation and characterization of mechanically alloyed Ti-Cu-Ni-Sn bulk metallic glass composites'. Together they form a unique fingerprint.

Cite this