Fabricatiion of 3D microfluidic networks with a hybrid stamp

Yu Chun Kung, Kuo Wei Huang, Y. Yang, Y. J. Fan, Pei Yu Chiou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

We report on a novel methodology for fabricating multilayer, high aspect ratio, 3D microfluidic structures with through-layer vias that can be bonded between two hard substrates. It is realized by using a plastic plate embedded PDMS stamp in soft lithography to obtain flat and open PDMS structures that can be stacked to form multiplayer 3D microfluidic networks in high yield without severe structure distortion. Our method also allows the control of the curvature of the channel sidewalls and the shape of channel cross section that may open up profound applications in electrokinetics, microoptics, and inertia microfluidics.

Original languageEnglish
Title of host publicationIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Pages915-918
Number of pages4
DOIs
Publication statusPublished - 2013
Externally publishedYes
EventIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan
Duration: Jan 20 2013Jan 24 2013

Conference

ConferenceIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
CountryTaiwan
CityTaipei
Period1/20/131/24/13

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Kung, Y. C., Huang, K. W., Yang, Y., Fan, Y. J., & Chiou, P. Y. (2013). Fabricatiion of 3D microfluidic networks with a hybrid stamp. In IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 (pp. 915-918). [6474393] https://doi.org/10.1109/MEMSYS.2013.6474393