The system designed in this study involves a three-dimensional (3D) microelectronic mechanical system chip structure using DNA printing technology. We employed diverse diameters and cavity thickness for the heater. DNA beads were placed in this rapid array, and the spray flow rate was assessed. Because DNA cannot be obtained easily, rapidly deploying DNA while estimating the total amount of DNA being sprayed is imperative. DNA printings were collected in a multiplexer driver microelectronic mechanical system head, and microflow estimation was conducted. Flow-3D was used to simulate the internal flow field and flow distribution of the 3D spray room. The simulation was used to calculate the time and pressure required to generate heat bubbles as well as the corresponding mean outlet speed of the fluid. The “outlet speed status” function in Flow-3D was used as a power source for simulating the ejection of fluid by the chip nozzle. The actual chip generation process was measured, and the starting voltage curve was analyzed. Finally, experiments on flow rate were conducted, and the results were discussed. The density of the injection nozzle was 50, the size of the heater was 105 µm × 105 µm, and the size of the injection nozzle hole was 80 µm. The maximum flow rate was limited to approximately 3.5 cc. The maximum flow rate per minute required a power between 3.5 W and 4.5 W. The number of injection nozzles was multiplied by 100. On chips with enlarged injection nozzle density, experiments were conducted under a fixed driving voltage of 25 V. The flow curve obtained from various pulse widths and operating frequencies was observed. The operating frequency was 2 KHz, and the pulse width was 4 µs. At a pulse width of 5 µs and within the power range of 4.3–5.7 W, the monomer was injected at a flow rate of 5.5 cc/min. The results of this study may be applied to estimate the flow rate and the total amount of the ejection liquid of a DNA liquid.
- DNA printing
- Flow estimation
ASJC Scopus subject areas
- Control and Systems Engineering
- Mechanical Engineering
- Electrical and Electronic Engineering