Design and fabrication of monolithic multidimensional data registration CMOS/MEMS ink-jet printhead

Jian Chiun Liou, Fan Gang Tseng, Chi Ming Huang

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A monolithic ink-jet printhead is designed and fabricated with back-shooting type of thermal bubble nucleation for high-speed and long-life printing in this paper. It combines micromechanics, including heating actuators, temperature sensor, channels, and nozzles, with an integrated multidimensional data registration CMOS demultiplexer driving circuit, which includes D flip-flop signal processing along with bidirectional data transfer and 12-V power amplifiers in a printhead chip. Microelectro-mechanical systems fabrication processes are applied to define the ink-firing chamber, feed channel, and the orifice plate within this new micro injector structure. In this paper, the printing resolution of this monolithic ink-jet head is 1200 dpi, and the diameter of nozzle orifice is about 14 μm with a thickness of 30 μm. Both the silicon dry and wet etching processes are applied to the fabrication of orifice plate with the control of thickness within ±4μm. The major advantage of the ink-jet chip assembly processes is that throughput is improved. The operating frequency of the monolithic ink-jet printhead developed in this paper is 24 kHz. The required voltage to start the bubble nucleation of printer head is 7.4 V, and the ink nozzle lifetime is 1.5 × 108. The optimization design of this monolithic ink-jet printhead could provide better printing quality than the commercial ones.

Original languageEnglish
Article number5512544
Pages (from-to)961-972
Number of pages12
JournalJournal of Microelectromechanical Systems
Volume19
Issue number4
DOIs
Publication statusPublished - Aug 2010
Externally publishedYes

Fingerprint

Ink
MEMS
Fabrication
Orifices
Printing
Nozzles
Nucleation
Dry etching
Micromechanics
Wet etching
Flip flop circuits
Temperature sensors
Data transfer
Power amplifiers
Signal processing
Actuators
Throughput
Heating
Silicon
Networks (circuits)

Keywords

  • Application-specific integrated circuit (ASIC)
  • droplet
  • ink-jet printhead
  • microelectromechanical systems (MEMS)
  • multifunction

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Design and fabrication of monolithic multidimensional data registration CMOS/MEMS ink-jet printhead. / Liou, Jian Chiun; Tseng, Fan Gang; Huang, Chi Ming.

In: Journal of Microelectromechanical Systems, Vol. 19, No. 4, 5512544, 08.2010, p. 961-972.

Research output: Contribution to journalArticle

@article{09fe0e64e71044fda6b951e9f5af53ee,
title = "Design and fabrication of monolithic multidimensional data registration CMOS/MEMS ink-jet printhead",
abstract = "A monolithic ink-jet printhead is designed and fabricated with back-shooting type of thermal bubble nucleation for high-speed and long-life printing in this paper. It combines micromechanics, including heating actuators, temperature sensor, channels, and nozzles, with an integrated multidimensional data registration CMOS demultiplexer driving circuit, which includes D flip-flop signal processing along with bidirectional data transfer and 12-V power amplifiers in a printhead chip. Microelectro-mechanical systems fabrication processes are applied to define the ink-firing chamber, feed channel, and the orifice plate within this new micro injector structure. In this paper, the printing resolution of this monolithic ink-jet head is 1200 dpi, and the diameter of nozzle orifice is about 14 μm with a thickness of 30 μm. Both the silicon dry and wet etching processes are applied to the fabrication of orifice plate with the control of thickness within ±4μm. The major advantage of the ink-jet chip assembly processes is that throughput is improved. The operating frequency of the monolithic ink-jet printhead developed in this paper is 24 kHz. The required voltage to start the bubble nucleation of printer head is 7.4 V, and the ink nozzle lifetime is 1.5 × 108. The optimization design of this monolithic ink-jet printhead could provide better printing quality than the commercial ones.",
keywords = "Application-specific integrated circuit (ASIC), droplet, ink-jet printhead, microelectromechanical systems (MEMS), multifunction",
author = "Liou, {Jian Chiun} and Tseng, {Fan Gang} and Huang, {Chi Ming}",
year = "2010",
month = "8",
doi = "10.1109/JMEMS.2010.2055548",
language = "English",
volume = "19",
pages = "961--972",
journal = "Journal of Microelectromechanical Systems",
issn = "1057-7157",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "4",

}

TY - JOUR

T1 - Design and fabrication of monolithic multidimensional data registration CMOS/MEMS ink-jet printhead

AU - Liou, Jian Chiun

AU - Tseng, Fan Gang

AU - Huang, Chi Ming

PY - 2010/8

Y1 - 2010/8

N2 - A monolithic ink-jet printhead is designed and fabricated with back-shooting type of thermal bubble nucleation for high-speed and long-life printing in this paper. It combines micromechanics, including heating actuators, temperature sensor, channels, and nozzles, with an integrated multidimensional data registration CMOS demultiplexer driving circuit, which includes D flip-flop signal processing along with bidirectional data transfer and 12-V power amplifiers in a printhead chip. Microelectro-mechanical systems fabrication processes are applied to define the ink-firing chamber, feed channel, and the orifice plate within this new micro injector structure. In this paper, the printing resolution of this monolithic ink-jet head is 1200 dpi, and the diameter of nozzle orifice is about 14 μm with a thickness of 30 μm. Both the silicon dry and wet etching processes are applied to the fabrication of orifice plate with the control of thickness within ±4μm. The major advantage of the ink-jet chip assembly processes is that throughput is improved. The operating frequency of the monolithic ink-jet printhead developed in this paper is 24 kHz. The required voltage to start the bubble nucleation of printer head is 7.4 V, and the ink nozzle lifetime is 1.5 × 108. The optimization design of this monolithic ink-jet printhead could provide better printing quality than the commercial ones.

AB - A monolithic ink-jet printhead is designed and fabricated with back-shooting type of thermal bubble nucleation for high-speed and long-life printing in this paper. It combines micromechanics, including heating actuators, temperature sensor, channels, and nozzles, with an integrated multidimensional data registration CMOS demultiplexer driving circuit, which includes D flip-flop signal processing along with bidirectional data transfer and 12-V power amplifiers in a printhead chip. Microelectro-mechanical systems fabrication processes are applied to define the ink-firing chamber, feed channel, and the orifice plate within this new micro injector structure. In this paper, the printing resolution of this monolithic ink-jet head is 1200 dpi, and the diameter of nozzle orifice is about 14 μm with a thickness of 30 μm. Both the silicon dry and wet etching processes are applied to the fabrication of orifice plate with the control of thickness within ±4μm. The major advantage of the ink-jet chip assembly processes is that throughput is improved. The operating frequency of the monolithic ink-jet printhead developed in this paper is 24 kHz. The required voltage to start the bubble nucleation of printer head is 7.4 V, and the ink nozzle lifetime is 1.5 × 108. The optimization design of this monolithic ink-jet printhead could provide better printing quality than the commercial ones.

KW - Application-specific integrated circuit (ASIC)

KW - droplet

KW - ink-jet printhead

KW - microelectromechanical systems (MEMS)

KW - multifunction

UR - http://www.scopus.com/inward/record.url?scp=77955414601&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77955414601&partnerID=8YFLogxK

U2 - 10.1109/JMEMS.2010.2055548

DO - 10.1109/JMEMS.2010.2055548

M3 - Article

AN - SCOPUS:77955414601

VL - 19

SP - 961

EP - 972

JO - Journal of Microelectromechanical Systems

JF - Journal of Microelectromechanical Systems

SN - 1057-7157

IS - 4

M1 - 5512544

ER -