Analysis on warpage of support structure of computer hard disk for optimum processing by precision injection molding

Yung Ning Wang, Her Shing Wang, Wen Tsung Ho, Yi Lin, Yung Kang Shen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This study emphasizes on warpage of support structure of computer hard disk for optimum processing by precision injection molding. Firstly, the authors use Moldflow software to analyze the runner's balance on multi-cavities for the support structure of computer hard disk. Then this study accords to these data to manufacture the real mold. This study uses different processing parameters (injection speed, injection pressure, mold temperature, packing time and melt temperature) to fabricate support structure of computer hard disk using precision injection molding. The authors use Taguchi method to find out which factor is more important for warpage of support structure of computer hard disk. The results show that the most important factor for warpage of support structure is followed by packing time, injection speed, melt temperature, packing time and the last one is the injection pressure.

Original languageEnglish
Title of host publicationInformation Technology and Computer Application Engineering - Proceedings of the 2013 International Conference on Information Technology and Computer Application Engineering, ITCAE 2013
Publishershers
Pages811-814
Number of pages4
Publication statusPublished - 2014
Event2013 International Conference on Information Technology and Computer Application Engineering, ITCAE 2013 - Hong Kong, China
Duration: Aug 27 2013Aug 28 2013

Other

Other2013 International Conference on Information Technology and Computer Application Engineering, ITCAE 2013
CountryChina
CityHong Kong
Period8/27/138/28/13

Fingerprint

Hard disk storage
Injection molding
Processing
Taguchi methods
Temperature

Keywords

  • Numerical simulation
  • Optimum processing
  • Precision injection molding
  • Warpage

ASJC Scopus subject areas

  • Computer Science Applications

Cite this

Wang, Y. N., Wang, H. S., Ho, W. T., Lin, Y., & Shen, Y. K. (2014). Analysis on warpage of support structure of computer hard disk for optimum processing by precision injection molding. In Information Technology and Computer Application Engineering - Proceedings of the 2013 International Conference on Information Technology and Computer Application Engineering, ITCAE 2013 (pp. 811-814). shers.

Analysis on warpage of support structure of computer hard disk for optimum processing by precision injection molding. / Wang, Yung Ning; Wang, Her Shing; Ho, Wen Tsung; Lin, Yi; Shen, Yung Kang.

Information Technology and Computer Application Engineering - Proceedings of the 2013 International Conference on Information Technology and Computer Application Engineering, ITCAE 2013. shers, 2014. p. 811-814.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wang, YN, Wang, HS, Ho, WT, Lin, Y & Shen, YK 2014, Analysis on warpage of support structure of computer hard disk for optimum processing by precision injection molding. in Information Technology and Computer Application Engineering - Proceedings of the 2013 International Conference on Information Technology and Computer Application Engineering, ITCAE 2013. shers, pp. 811-814, 2013 International Conference on Information Technology and Computer Application Engineering, ITCAE 2013, Hong Kong, China, 8/27/13.
Wang YN, Wang HS, Ho WT, Lin Y, Shen YK. Analysis on warpage of support structure of computer hard disk for optimum processing by precision injection molding. In Information Technology and Computer Application Engineering - Proceedings of the 2013 International Conference on Information Technology and Computer Application Engineering, ITCAE 2013. shers. 2014. p. 811-814
Wang, Yung Ning ; Wang, Her Shing ; Ho, Wen Tsung ; Lin, Yi ; Shen, Yung Kang. / Analysis on warpage of support structure of computer hard disk for optimum processing by precision injection molding. Information Technology and Computer Application Engineering - Proceedings of the 2013 International Conference on Information Technology and Computer Application Engineering, ITCAE 2013. shers, 2014. pp. 811-814
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