Analysis of the mold filling process on flip chip package

Y. K. Shen, S. H. Chen, H. C. Lee

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Flip chip package is the most important technology in IC package in terms of scale, velocity and cost in the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. This paper describes the analysis package of the solder ball and microchip for mold flow simulation (3D, midplane) and experiment. The numerical simulation of mold filling process is based on the concept of control volume finite element method. The injection point uses the corner, 1/4 side and central injection location. The injection process uses different parameters (mold temperature, injection temperature, injection pressure and injection time). For processing situation, the best result is from central injection, then 1/4 side injection and then corner injection. The results also show that the filling situation for 3D numerical simulation is closer to experiment.

Original languageEnglish
Pages (from-to)407-428
Number of pages22
JournalJournal of Reinforced Plastics and Composites
Volume23
Issue number4
Publication statusPublished - 2004
Externally publishedYes

Fingerprint

Flow simulation
Computer simulation
Soldering alloys
Costs
Innovation
Experiments
Semiconductor materials
Finite element method
Temperature
Processing

Keywords

  • 3D simulation
  • Flip chip
  • Flow visualization
  • Midplane simulation
  • Solder ball

ASJC Scopus subject areas

  • Ceramics and Composites
  • Polymers and Plastics
  • Materials Chemistry

Cite this

Analysis of the mold filling process on flip chip package. / Shen, Y. K.; Chen, S. H.; Lee, H. C.

In: Journal of Reinforced Plastics and Composites, Vol. 23, No. 4, 2004, p. 407-428.

Research output: Contribution to journalArticle

@article{6348c88404334cf6b08a754660c6919d,
title = "Analysis of the mold filling process on flip chip package",
abstract = "Flip chip package is the most important technology in IC package in terms of scale, velocity and cost in the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. This paper describes the analysis package of the solder ball and microchip for mold flow simulation (3D, midplane) and experiment. The numerical simulation of mold filling process is based on the concept of control volume finite element method. The injection point uses the corner, 1/4 side and central injection location. The injection process uses different parameters (mold temperature, injection temperature, injection pressure and injection time). For processing situation, the best result is from central injection, then 1/4 side injection and then corner injection. The results also show that the filling situation for 3D numerical simulation is closer to experiment.",
keywords = "3D simulation, Flip chip, Flow visualization, Midplane simulation, Solder ball",
author = "Shen, {Y. K.} and Chen, {S. H.} and Lee, {H. C.}",
year = "2004",
language = "English",
volume = "23",
pages = "407--428",
journal = "Journal of Reinforced Plastics and Composites",
issn = "0731-6844",
publisher = "SAGE Publications Ltd",
number = "4",

}

TY - JOUR

T1 - Analysis of the mold filling process on flip chip package

AU - Shen, Y. K.

AU - Chen, S. H.

AU - Lee, H. C.

PY - 2004

Y1 - 2004

N2 - Flip chip package is the most important technology in IC package in terms of scale, velocity and cost in the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. This paper describes the analysis package of the solder ball and microchip for mold flow simulation (3D, midplane) and experiment. The numerical simulation of mold filling process is based on the concept of control volume finite element method. The injection point uses the corner, 1/4 side and central injection location. The injection process uses different parameters (mold temperature, injection temperature, injection pressure and injection time). For processing situation, the best result is from central injection, then 1/4 side injection and then corner injection. The results also show that the filling situation for 3D numerical simulation is closer to experiment.

AB - Flip chip package is the most important technology in IC package in terms of scale, velocity and cost in the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. This paper describes the analysis package of the solder ball and microchip for mold flow simulation (3D, midplane) and experiment. The numerical simulation of mold filling process is based on the concept of control volume finite element method. The injection point uses the corner, 1/4 side and central injection location. The injection process uses different parameters (mold temperature, injection temperature, injection pressure and injection time). For processing situation, the best result is from central injection, then 1/4 side injection and then corner injection. The results also show that the filling situation for 3D numerical simulation is closer to experiment.

KW - 3D simulation

KW - Flip chip

KW - Flow visualization

KW - Midplane simulation

KW - Solder ball

UR - http://www.scopus.com/inward/record.url?scp=1642390794&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=1642390794&partnerID=8YFLogxK

M3 - Article

VL - 23

SP - 407

EP - 428

JO - Journal of Reinforced Plastics and Composites

JF - Journal of Reinforced Plastics and Composites

SN - 0731-6844

IS - 4

ER -