Analysis of the mold filling process on flip chip package

Y. K. Shen, S. H. Chen, H. C. Lee

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Flip chip package is the most important technology in IC package in terms of scale, velocity and cost in the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. This paper describes the analysis package of the solder ball and microchip for mold flow simulation (3D, midplane) and experiment. The numerical simulation of mold filling process is based on the concept of control volume finite element method. The injection point uses the corner, 1/4 side and central injection location. The injection process uses different parameters (mold temperature, injection temperature, injection pressure and injection time). For processing situation, the best result is from central injection, then 1/4 side injection and then corner injection. The results also show that the filling situation for 3D numerical simulation is closer to experiment.

Original languageEnglish
Pages (from-to)407-428
Number of pages22
JournalJournal of Reinforced Plastics and Composites
Volume23
Issue number4
Publication statusPublished - 2004
Externally publishedYes

Keywords

  • 3D simulation
  • Flip chip
  • Flow visualization
  • Midplane simulation
  • Solder ball

ASJC Scopus subject areas

  • Ceramics and Composites
  • Polymers and Plastics
  • Materials Chemistry

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