Abstract
Flip chip package is the most important technology in IC package in terms of scale, velocity and cost in the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. This paper describes the analysis package of the solder ball and microchip for mold flow simulation (3D, midplane) and experiment. The numerical simulation of mold filling process is based on the concept of control volume finite element method. The injection point uses the corner, 1/4 side and central injection location. The injection process uses different parameters (mold temperature, injection temperature, injection pressure and injection time). For processing situation, the best result is from central injection, then 1/4 side injection and then corner injection. The results also show that the filling situation for 3D numerical simulation is closer to experiment.
| Original language | English |
|---|---|
| Pages (from-to) | 407-428 |
| Number of pages | 22 |
| Journal | Journal of Reinforced Plastics and Composites |
| Volume | 23 |
| Issue number | 4 |
| Publication status | Published - 2004 |
| Externally published | Yes |
Fingerprint
Keywords
- 3D simulation
- Flip chip
- Flow visualization
- Midplane simulation
- Solder ball
ASJC Scopus subject areas
- Ceramics and Composites
- Polymers and Plastics
- Materials Chemistry
Cite this
Analysis of the mold filling process on flip chip package. / Shen, Y. K.; Chen, S. H.; Lee, H. C.
In: Journal of Reinforced Plastics and Composites, Vol. 23, No. 4, 2004, p. 407-428.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Analysis of the mold filling process on flip chip package
AU - Shen, Y. K.
AU - Chen, S. H.
AU - Lee, H. C.
PY - 2004
Y1 - 2004
N2 - Flip chip package is the most important technology in IC package in terms of scale, velocity and cost in the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. This paper describes the analysis package of the solder ball and microchip for mold flow simulation (3D, midplane) and experiment. The numerical simulation of mold filling process is based on the concept of control volume finite element method. The injection point uses the corner, 1/4 side and central injection location. The injection process uses different parameters (mold temperature, injection temperature, injection pressure and injection time). For processing situation, the best result is from central injection, then 1/4 side injection and then corner injection. The results also show that the filling situation for 3D numerical simulation is closer to experiment.
AB - Flip chip package is the most important technology in IC package in terms of scale, velocity and cost in the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. This paper describes the analysis package of the solder ball and microchip for mold flow simulation (3D, midplane) and experiment. The numerical simulation of mold filling process is based on the concept of control volume finite element method. The injection point uses the corner, 1/4 side and central injection location. The injection process uses different parameters (mold temperature, injection temperature, injection pressure and injection time). For processing situation, the best result is from central injection, then 1/4 side injection and then corner injection. The results also show that the filling situation for 3D numerical simulation is closer to experiment.
KW - 3D simulation
KW - Flip chip
KW - Flow visualization
KW - Midplane simulation
KW - Solder ball
UR - http://www.scopus.com/inward/record.url?scp=1642390794&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=1642390794&partnerID=8YFLogxK
M3 - Article
VL - 23
SP - 407
EP - 428
JO - Journal of Reinforced Plastics and Composites
JF - Journal of Reinforced Plastics and Composites
SN - 0731-6844
IS - 4
ER -