Analysis of mold insert fabrication for the processing of microfluidic chip

Y. K. Shen, J. D. Lin, R. H. Hong

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

The microflyidic chip has been ysed as an example to discuss different mold insert materials by micro hotembossing molding. For the mold insert, this study uses the SU-8 photoresist to coat on the silicon wafer, then yses UV light to expose the pattern on the surface of SU-8 photoresist, and coat the seed layer on the SU-8 structure using thermal evaporation. The micro electroforming technology has been combined to fabricate the mold inserts (Ni, Ni-Co) followed by replicating the microstructure from the metal mold insert by micro-hot embossing molding. Different processing parameters (Embossing temperature, embossing pressure, embossing time, and demolding temperature) for the properties of COP film of microfluidic chip have been discussed. The results show that the most important parameter is the embossing temperature for replication properties of molded microflyidic chip. The demolding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The Ni-Co mold insert is the most suitable mold material for molded microfluidic chip by microhot embossing molding. The bonding temperature is the most important factor for the bonding strength of sealed microfluidic chip by tensile bonding test.

Original languageEnglish
Pages (from-to)104-114
Number of pages11
JournalPolymer Engineering and Science
Volume49
Issue number1
DOIs
Publication statusPublished - Jan 2009

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Die casting inserts
Microfluidics
Molding
Fabrication
Photoresists
Processing
Electroforming
Temperature
Thermal evaporation
Silicon wafers
Ultraviolet radiation
Seed
Surface roughness
Metals
Microstructure

ASJC Scopus subject areas

  • Polymers and Plastics
  • Materials Chemistry
  • Chemistry(all)

Cite this

Analysis of mold insert fabrication for the processing of microfluidic chip. / Shen, Y. K.; Lin, J. D.; Hong, R. H.

In: Polymer Engineering and Science, Vol. 49, No. 1, 01.2009, p. 104-114.

Research output: Contribution to journalArticle

@article{0e6a99f9334340feb3c29f3f17dc8120,
title = "Analysis of mold insert fabrication for the processing of microfluidic chip",
abstract = "The microflyidic chip has been ysed as an example to discuss different mold insert materials by micro hotembossing molding. For the mold insert, this study uses the SU-8 photoresist to coat on the silicon wafer, then yses UV light to expose the pattern on the surface of SU-8 photoresist, and coat the seed layer on the SU-8 structure using thermal evaporation. The micro electroforming technology has been combined to fabricate the mold inserts (Ni, Ni-Co) followed by replicating the microstructure from the metal mold insert by micro-hot embossing molding. Different processing parameters (Embossing temperature, embossing pressure, embossing time, and demolding temperature) for the properties of COP film of microfluidic chip have been discussed. The results show that the most important parameter is the embossing temperature for replication properties of molded microflyidic chip. The demolding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The Ni-Co mold insert is the most suitable mold material for molded microfluidic chip by microhot embossing molding. The bonding temperature is the most important factor for the bonding strength of sealed microfluidic chip by tensile bonding test.",
author = "Shen, {Y. K.} and Lin, {J. D.} and Hong, {R. H.}",
year = "2009",
month = "1",
doi = "10.1002/pen.21227",
language = "English",
volume = "49",
pages = "104--114",
journal = "Polymer Engineering and Science",
issn = "0032-3888",
publisher = "Society of Plastics Engineers",
number = "1",

}

TY - JOUR

T1 - Analysis of mold insert fabrication for the processing of microfluidic chip

AU - Shen, Y. K.

AU - Lin, J. D.

AU - Hong, R. H.

PY - 2009/1

Y1 - 2009/1

N2 - The microflyidic chip has been ysed as an example to discuss different mold insert materials by micro hotembossing molding. For the mold insert, this study uses the SU-8 photoresist to coat on the silicon wafer, then yses UV light to expose the pattern on the surface of SU-8 photoresist, and coat the seed layer on the SU-8 structure using thermal evaporation. The micro electroforming technology has been combined to fabricate the mold inserts (Ni, Ni-Co) followed by replicating the microstructure from the metal mold insert by micro-hot embossing molding. Different processing parameters (Embossing temperature, embossing pressure, embossing time, and demolding temperature) for the properties of COP film of microfluidic chip have been discussed. The results show that the most important parameter is the embossing temperature for replication properties of molded microflyidic chip. The demolding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The Ni-Co mold insert is the most suitable mold material for molded microfluidic chip by microhot embossing molding. The bonding temperature is the most important factor for the bonding strength of sealed microfluidic chip by tensile bonding test.

AB - The microflyidic chip has been ysed as an example to discuss different mold insert materials by micro hotembossing molding. For the mold insert, this study uses the SU-8 photoresist to coat on the silicon wafer, then yses UV light to expose the pattern on the surface of SU-8 photoresist, and coat the seed layer on the SU-8 structure using thermal evaporation. The micro electroforming technology has been combined to fabricate the mold inserts (Ni, Ni-Co) followed by replicating the microstructure from the metal mold insert by micro-hot embossing molding. Different processing parameters (Embossing temperature, embossing pressure, embossing time, and demolding temperature) for the properties of COP film of microfluidic chip have been discussed. The results show that the most important parameter is the embossing temperature for replication properties of molded microflyidic chip. The demolding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The Ni-Co mold insert is the most suitable mold material for molded microfluidic chip by microhot embossing molding. The bonding temperature is the most important factor for the bonding strength of sealed microfluidic chip by tensile bonding test.

UR - http://www.scopus.com/inward/record.url?scp=59349096986&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=59349096986&partnerID=8YFLogxK

U2 - 10.1002/pen.21227

DO - 10.1002/pen.21227

M3 - Article

AN - SCOPUS:59349096986

VL - 49

SP - 104

EP - 114

JO - Polymer Engineering and Science

JF - Polymer Engineering and Science

SN - 0032-3888

IS - 1

ER -