Analysis for replication and surface roughness of micro-feature of silicon mold insert by UV-LIGA method

Chiung Fang Huang, Jeol Long Lee, Yung Kang Shen, Chi Wei Wu, Yi Lin, Sung Chih Hsu, Ming Wei Wu, Chung Yu Kao

Research output: Contribution to journalArticle

Abstract

This study demonstrates the replication property and surface roughness for metal micro-mold that combines the replica molding (REM) and electroforming techniques. The micro-mold firstly uses the silicon wafer to fabricate the master mold by UV-LIGA method, and then uses the sputtering method to sputter the Ni element as the seed layer on the surface of master mold. The electroforming method manufactures the Ni mold insert from the master mold with seed layer. Finally, this study uses the PDMS material to replicate the micro-feature from the Ni mold insert by replica molding. This study indicates the replication property and surface roughness of different micro-feature shapes and sizes (concave and convex) for Ni mold insert and molded PDMS.

Original languageEnglish
Pages (from-to)443-446
Number of pages4
JournalAdvanced Materials Research
Volume47-50 PART 1
Publication statusPublished - 2008
EventMulti-functional Materials and Structures - International Conference on Multifunctional Materials and Structures - Hong Kong, P.R., China
Duration: Jul 28 2008Jul 31 2008

Fingerprint

Electroforming
Molding
Seed
Surface roughness
Silicon
Die casting inserts
Silicon wafers
Sputtering
Metals

Keywords

  • Electroforming
  • Micro-feature
  • Replication
  • Surface roughness
  • UV-LIGA

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Analysis for replication and surface roughness of micro-feature of silicon mold insert by UV-LIGA method. / Huang, Chiung Fang; Lee, Jeol Long; Shen, Yung Kang; Wu, Chi Wei; Lin, Yi; Hsu, Sung Chih; Wu, Ming Wei; Kao, Chung Yu.

In: Advanced Materials Research, Vol. 47-50 PART 1, 2008, p. 443-446.

Research output: Contribution to journalArticle

Huang, Chiung Fang ; Lee, Jeol Long ; Shen, Yung Kang ; Wu, Chi Wei ; Lin, Yi ; Hsu, Sung Chih ; Wu, Ming Wei ; Kao, Chung Yu. / Analysis for replication and surface roughness of micro-feature of silicon mold insert by UV-LIGA method. In: Advanced Materials Research. 2008 ; Vol. 47-50 PART 1. pp. 443-446.
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AU - Wu, Ming Wei

AU - Kao, Chung Yu

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AB - This study demonstrates the replication property and surface roughness for metal micro-mold that combines the replica molding (REM) and electroforming techniques. The micro-mold firstly uses the silicon wafer to fabricate the master mold by UV-LIGA method, and then uses the sputtering method to sputter the Ni element as the seed layer on the surface of master mold. The electroforming method manufactures the Ni mold insert from the master mold with seed layer. Finally, this study uses the PDMS material to replicate the micro-feature from the Ni mold insert by replica molding. This study indicates the replication property and surface roughness of different micro-feature shapes and sizes (concave and convex) for Ni mold insert and molded PDMS.

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