Analysis for optimal gate design of thin-walled injection molding

Yung Kang Shen, Chih Wei Wu, Ya Feng Yu, Hung Wei Chung

Research output: Contribution to journalArticle

20 Citations (Scopus)

Abstract

The 3C (Computer, Communication and Consumer) product has the properties of being light, thin, short and small. In this study, numerical simulations of three-dimensional injection molding are used for thin-walled product. The governing differential equations are discredited by using control volume finite element method. This research points out the processing phenomenon of electronic dictionary battery covers in thin-walled injection molding. This research emphasizes the gate design of thin-walled injection molding for PC+ABS materials. The results show that the gate for single point of two sides is suitable on thin-walled injection molding by numerical simulation. The results also show that the processing is very well for thin-walled injection molding by numerical simulation.

Original languageEnglish
Pages (from-to)728-734
Number of pages7
JournalInternational Communications in Heat and Mass Transfer
Volume35
Issue number6
DOIs
Publication statusPublished - Jul 2008

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Keywords

  • Gate design
  • MoldFlow
  • Numerical simulation
  • Thin-walled product

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Mechanical Engineering

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